MANUFACTURING METHOD AND TEST METHOD OF POWER MODULE

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MANUFACTURING METHOD AND TEST METHOD OF POWER MODULE

This abstract first appeared for US patent application 18432506 titled 'MANUFACTURING METHOD AND TEST METHOD OF POWER MODULE

Original Abstract Submitted

A manufacturing method of a power module includes operations of bonding a semiconductor device to a lower substrate, disposing an upper bonding member on an upper portion of the semiconductor device; contacting a probe device with the upper bonding member, electrically connecting the probe device to a tester and testing electrical characteristics of the semiconductor device, and bonding an upper substrate to the semiconductor device through the upper bonding member.