There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:CPC H01L23/544
Jump to navigation
Jump to search
Pages in category "CPC H01L23/544"
The following 163 pages are in this category, out of 163 total.
1
- 18090140. SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract (Intel Corporation)
- 18122250. FIDUCIAL DESIGN OPTIMIZATION FOR LAND SIDE DEVICE ANYWHERE PACKAGE ASSEMBLY simplified abstract (Intel Corporation)
- 18130692. SUBSTRATE BARCODE READABILITY ENHANCEMENT STRUCTURES AND METHOD simplified abstract (Infineon Technologies AG)
- 18181584. SEMICONDUCTOR DEVICE AND MANUFACTURE METHOD simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18216744. DUAL FUNCTIONING ALIGNMENT AND ETCH BIAS STRUCTURES (International Business Machines Corporation)
- 18319349. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
- 18345820. SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT (Intel Corporation)
- 18346098. FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT (Intel Corporation)
- 18346108. FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES (Intel Corporation)
- 18346840. METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18408194. Integrated Circuitry, Memory Circuitry Comprising Strings Of Memory Cells, And Methods Used In Forming Integrated Circuitry simplified abstract (Micron Technology, Inc.)
- 18420972. PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18421399. PHOTOLITHOGRAPHY METHOD AND STRUCTURES THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18422996. DISPLAY DEVICE simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18464815. PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18465982. BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APPARATUS FOR MANUFACTURING THE SAME simplified abstract (SK hynix Inc.)
- 18470421. OVERLAY MARK (MACRONIX INTERNATIONAL CO., LTD.)
- 18481133. ALIGNMENT PATTERN HAVING AN E SHAPE simplified abstract (Micron Technology, Inc.)
- 18489354. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18515797. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18525500. PACKAGE, SEMICONDUCTOR DEVICE, AND APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18535231. SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN simplified abstract (Samsung Electronics Co., Ltd.)
- 18537128. IDENTIFICATION INFORMATION ACQUISITION METHOD, PATTERN FORMING METHOD, SEMICONDUCTOR MANUFACTURING FACILITY OPERATION METHOD, PROCESSING APPARATUS, AND PATTERN FORMING APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18581596. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18593504. FLEXIBLE DESIGN AND PLACEMENT OF ALIGNMENT MARKS simplified abstract (Micron Technology, Inc.)
- 18611841. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18630178. SEMICONDUCTOR DEVICE HAVING TEST PATTERN (SAMSUNG ELECTRONICS CO., LTD.)
- 18632486. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (SAMSUNG ELECTRONICS CO., LTD.)
- 18711091. METHOD FOR MARKING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR CHIP (Mitsubishi Electric Corporation)
- 18736947. ALIGNMENT MARK STRUCTURE AND METHOD FOR MAKING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18762757. METHOD OF MARKING SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18808203. ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD (Murata Manufacturing Co., Ltd.)
- 18816215. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18885846. SEMICONDUCTOR DEVICE WITH A SILICON CARBIDE PORTION AND A GLASS STRUCTURE AND METHOD OF MANUFACTURING (Infineon Technologies AG)
- 18947320. DISPLAY DEVICES AND METHODS FOR MANUFACTURING THE SAME (InnoLux Corporation)
A
C
- Canon kabushiki kaisha (20240213176). IDENTIFICATION INFORMATION ACQUISITION METHOD, PATTERN FORMING METHOD, SEMICONDUCTOR MANUFACTURING FACILITY OPERATION METHOD, PROCESSING APPARATUS, AND PATTERN FORMING APPARATUS simplified abstract
- CANON KABUSHIKI KAISHA Patent Application Trends in 2025
- CANON KABUSHIKI KAISHA patent applications on June 27th, 2024
D
I
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240222288). SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract
- Intel corporation (20240312924). FIDUCIAL DESIGN OPTIMIZATION FOR LAND SIDE DEVICE ANYWHERE PACKAGE ASSEMBLY simplified abstract
- Intel corporation (20240355758). METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIATED INTEGRATED CIRCUIT PACKAGES HAVING GLASS CORES simplified abstract
- Intel corporation (20250006651). SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
- Intel corporation (20250006652). FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
- Intel corporation (20250006653). FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on October 24th, 2024
- Intel Corporation patent applications on September 19th, 2024
- International business machines corporation (20250006649). DUAL FUNCTIONING ALIGNMENT AND ETCH BIAS STRUCTURES
- International Business Machines Corporation Patent Application Trends in 2025
- International Business Machines Corporation patent applications on February 13th, 2025
- International Business Machines Corporation patent applications on January 2nd, 2025
- IQM FINLAND OY Patent Application Trends in 2024
L
M
- Macronix International Co., Ltd. Patent Application Trends in 2025
- MACRONIX INTERNATIONAL CO., LTD. Patent Application Trends in 2025
- Micron technology, inc. (20240243072). Integrated Circuitry, Memory Circuitry Comprising Strings Of Memory Cells, And Methods Used In Forming Integrated Circuitry simplified abstract
- Micron technology, inc. (20240258244). METHODS FOR MECHANICAL SELF-ALIGNMENT AND SLIP-RESISTANCE IN BONDING SEMICONDUCTOR SUBSTRATES, AND SEMICONDUCTOR DEVICES COMPRISING MECHANICAL SELF-ALIGNMENT STRUCTURES simplified abstract
- Micron technology, inc. (20240297124). FLEXIBLE DESIGN AND PLACEMENT OF ALIGNMENT MARKS simplified abstract
- Micron technology, inc. (20250006655). PHOTOALIGNMENT OF SEMICONDUCTOR STRUCTURES USING AN OPAQUE HARDMASK
- Micron Technology, Inc. Patent Application Trends in 2024
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Micron Technology, Inc. patent applications on August 1st, 2024
- Micron Technology, Inc. patent applications on February 6th, 2025
- Micron Technology, Inc. patent applications on January 2nd, 2025
- Micron Technology, Inc. patent applications on July 18th, 2024
- Micron Technology, Inc. patent applications on September 5th, 2024
- Mitsubishi electric corporation (20250015013). METHOD FOR MARKING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR CHIP
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on January 9th, 2025
- Murata manufacturing co., ltd. (20250070040). ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD
- Murata Manufacturing Co., Ltd. patent applications on February 27th, 2025
S
- Samsung Display Co., LTD Patent Application Trends in 2024
- Samsung display co., ltd. (20240194612). DISPLAY DEVICE simplified abstract
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240213174). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240213175). SEMICONDUCTOR PACKAGE HAVING ALIGNMENT PATTERN simplified abstract
- Samsung electronics co., ltd. (20240234332). SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321766). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME simplified abstract
- Samsung electronics co., ltd. (20240355757). SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240421099). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20240429176). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Samsung electronics co., ltd. (20250006654). SEMICONDUCTOR DEVICE HAVING TEST PATTERN
- Samsung electronics co., ltd. (20250070039). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Samsung electronics co., ltd. (20250087593). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250096148). METHOD OF MARKING SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- Samsung Electronics Co., Ltd. patent applications on January 30th, 2025
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on October 24th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- SAMSUNG ELECTRONICS CO.,LTD Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD Patent Application Trends in 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. Patent Application Trends in 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Patent Application Trends in 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- Sk hynix inc. (20240347470). BONDING STRUCTURE, METHOD OF MANUFACTURING THE SAME AND BONDING APPARATUS FOR MANUFACTURING THE SAME simplified abstract
- SK hynix Inc. Patent Application Trends in 2025
- SK hynix Inc. patent applications on January 30th, 2025
- SK hynix Inc. patent applications on October 17th, 2024
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20250087592). PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Taiwan semiconductor manufacturing co., ltd. (20250096146). PHOTOLITHOGRAPHY METHOD AND STRUCTURES THEREOF
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240321767). ALIGNMENT MARK STRUCTURE AND METHOD FOR MAKING simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 13th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- Tesla Patent Application Trends in 2024
- Tesla, inc. (20240234333). WAFER ALIGNMENT STRUCTURE simplified abstract
- Tesla, Inc. patent applications on July 11th, 2024
- ThinSiC Inc Patent Application Trends in 2024
- Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd. Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2024
- TOPPAN INC. Patent Application Trends in 2024
