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Category:CPC H01L23/5329
Pages in category "CPC H01L23/5329"
The following 40 pages are in this category, out of 40 total.
1
- 18100570. ELECTRONIC DEVICE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18119947. SEMICONDUCTOR DEVICE WITH FILLING LAYER simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18380883. SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18535143. SEMICONDUCTOR DEVICE HAVING A REINFORCING INSULATING LAYER CORRESPONDING TO A VIA simplified abstract (Samsung Electronics Co., Ltd.)
- 18608349. Semiconductor Structure Having High Breakdown Voltage Etch-Stop Layer simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18929920. METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND STRUCTURE THEREOF (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18944359. INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METHOD FOR MANUFACTURING THE SAME (NANYA TECHNOLOGY CORPORATION)
I
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240213160). SEMICONDUCTOR DEVICE HAVING A REINFORCING INSULATING LAYER CORRESPONDING TO A VIA simplified abstract
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on February 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240266292). Semiconductor Structure Having High Breakdown Voltage Etch-Stop Layer simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250070027). METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND STRUCTURE THEREOF
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 27th, 2025