18119947. SEMICONDUCTOR DEVICE WITH FILLING LAYER simplified abstract (NANYA TECHNOLOGY CORPORATION)
SEMICONDUCTOR DEVICE WITH FILLING LAYER
Organization Name
Inventor(s)
TSE-YAO Huang of TAIPEI CITY (TW)
SEMICONDUCTOR DEVICE WITH FILLING LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18119947 titled 'SEMICONDUCTOR DEVICE WITH FILLING LAYER
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a plurality of conductive layers positioned on the substrate; a filling layer positioned between the plurality of conductive layers; an air gap positioned in the filling layer; and a dielectric layer positioned on the plurality of conductive layers and the filling layer. The filling layer includes boron carbonitride.
- The semiconductor device includes a unique filling layer made of boron carbonitride.
- The filling layer contains an air gap, providing insulation between the conductive layers.
- The innovative design of the semiconductor device enhances performance and efficiency.
- The method for fabricating the semiconductor device involves precise layering techniques.
- The use of boron carbonitride in the filling layer improves the overall functionality of the device.
Potential Applications: The semiconductor device can be used in various electronic applications such as integrated circuits, microprocessors, and memory devices.
Problems Solved: The semiconductor device addresses issues related to insulation, performance, and efficiency in electronic devices.
Benefits: The semiconductor device offers improved functionality, enhanced performance, and increased efficiency in electronic applications.
Commercial Applications: The semiconductor device can be utilized in the semiconductor industry for the production of advanced electronic components.
Questions about Semiconductor Devices: 1. How does the use of boron carbonitride in the filling layer impact the performance of the semiconductor device?
- The use of boron carbonitride enhances insulation and efficiency in the device.
2. What are the potential commercial applications of semiconductor devices with unique filling layers?
- Semiconductor devices with innovative filling layers can be used in various electronic applications to improve performance and efficiency.
Original Abstract Submitted
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a plurality of conductive layers positioned on the substrate; a filling layer positioned between the plurality of conductive layers; an air gap positioned in the filling layer; and a dielectric layer positioned on the plurality of conductive layers and the filling layer. The filling layer includes boron carbonitride.