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Category:CPC H01L23/49
Pages in category "CPC H01L23/49"
The following 20 pages are in this category, out of 20 total.
1
- 18333711. INTEGRATED CIRCUIT DEVICE WITH VERTICAL VIA PIN (Intel Corporation)
- 18692588. SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18734627. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18770168. ELECTRONIC COMPONENT EMBEDDED MODULE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED MODULE (Samsung Electronics Co., Ltd.)
- 18977556. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
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- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Mitsubishi electric corporation (20250132230). SEMICONDUCTOR DEVICE
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on April 24th, 2025
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- Samsung electronics co., ltd. (20250105100). SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250125226). ELECTRONIC COMPONENT EMBEDDED MODULE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED MODULE
- Samsung Electronics Co., Ltd. patent applications on April 17th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
