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Category:CPC H01L23/315
Pages in category "CPC H01L23/315"
The following 27 pages are in this category, out of 27 total.
1
- 18099056. SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18348934. MOLDING COMPOUND LAYERS IN SEMICONDUCTOR PACKAGES (Apple Inc.)
- 18367801. SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER (Samsung Electronics Co., Ltd.)
- 18455163. CAVITY INTEGRATED CIRCUIT (Texas Instruments Incorporated)
- 18617517. ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES simplified abstract (Texas Instruments Incorporated)
- 18974219. INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTURING THE SAME (TEXAS INSTRUMENTS INCORPORATED)
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- Samsung electronics co., ltd. (20250087544). SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION Patent Application Trends in 2025
- Sony Semiconductor Solutions Corporation Patent Application Trends in 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Texas instruments incorporated (20250105079). INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTURING THE SAME
- TEXAS INSTRUMENTS INCORPORATED patent applications on March 27th, 2025
- TSINGHUA UNIVERSITY Patent Application Trends in 2025
- Tsinghua University Patent Application Trends in 2025