Samsung electronics co., ltd. (20250087544). SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER
SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER
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SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER
This abstract first appeared for US patent application 20250087544 titled 'SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER
Original Abstract Submitted
provided is a semiconductor package including a first wiring structure including a plurality of first wiring patterns respectively including a plurality of first lower surface connection pads and a plurality of first upper surface connection pads, a second wiring structure including a plurality of second wiring patterns respectively including a plurality of second lower surface connection pads and a plurality of second upper surface connection pads, a semiconductor chip arranged between the first wiring structure and the second wiring structure, a plurality of connection structures connecting some of the plurality of first upper surface connection pads to the plurality of second lower surface connection pads, and arranged adjacent to the semiconductor chip, and a binding reinforcement layer on side surfaces of each of the plurality of connection structures and at least a portion of the semiconductor chip.
