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Category:CPC H01L23/10
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Pages in category "CPC H01L23/10"
The following 43 pages are in this category, out of 43 total.
1
- 18557785. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18674930. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18734669. THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION CIRCUIT simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18982861. SEAL RING STRUCTURE FOR SEMICONDUCTOR DEVICE AND THE METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
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- SAMSUNG ELECTRO-MECHANICS CO., LTD. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- STMicroelectronics International N.V. Patent Application Trends in 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. Patent Application Trends in 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240312852). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250118606). SEAL RING STRUCTURE FOR SEMICONDUCTOR DEVICE AND THE METHOD THEREOF
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 10th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240379475). PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 23rd, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024