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Category:CPC H01L22/12
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Pages in category "CPC H01L22/12"
The following 105 pages are in this category, out of 105 total.
1
- 18093139. Method and Apparatus for Substrate Temperature Control simplified abstract (Applied Materials, Inc.)
- 18139674. APPARATUS FOR MEASURING AN ADHESION FORCE simplified abstract (Samsung Electronics Co., Ltd.)
- 18202650. METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER simplified abstract (Samsung Electronics Co., Ltd.)
- 18305714. WAFER MANUFACTURING SYSTEM AND METHOD FOR MANUFACTURING WAFERS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18370139. DEVICE AND METHOD FOR SORTING SEMICONDUCTOR CHIP WITH POTENTIAL FAILURE RISK simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18382998. METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING A WAFER INSPECTION APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18436154. MEASUREMENT METHOD, CONVEYANCE METHOD, ARTICLE MANUFACTURING METHOD, CONVEYANCE APPARATUS, AND LITHOGRAPHY APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18508566. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18556695. METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18611531. ON-THE-FLY MEASUREMENT OF SUBSTRATE STRUCTURES simplified abstract (Applied Materials, Inc.)
- 18625788. SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18757511. METHOD FOR MEASURING OVERLAY SHIFT OF BONDED WAFERS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
A
- AGC Inc. Patent Application Trends in 2024
- AGC INC. Patent Application Trends in 2024
- Applied materials, inc. (20240266230). OPTIMIZED FILM DEPOSITION AND ION IMPLANTATION FOR MITIGATION OF STRESS AND DEFORMATION IN SUBSTRATES simplified abstract
- Applied materials, inc. (20240266231). CYLINDRIC DECOMPOSITION FOR EFFICIENT MITIGATION OF SUBSTRATE DEFORMATION WITH FILM DEPOSITION AND ION IMPLANTATION simplified abstract
- Applied materials, inc. (20250006563). CHARACTERIZING DEFECTS IN SEMICONDUCTOR LAYERS
- Applied Materials, Inc. patent applications on August 8th, 2024
- Applied Materials, Inc. patent applications on January 2nd, 2025
- ASML NETHERLANDS B.V. Patent Application Trends in 2024
- ASML NETHERLANDS B.V. Patent Application Trends in 2025
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- Macronix International Co., Ltd. Patent Application Trends in 2025
- MACRONIX INTERNATIONAL CO., LTD. Patent Application Trends in 2025
- Micron technology, inc. (20240413021). METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING BONDING VOIDS
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Micron Technology, Inc. patent applications on December 12th, 2024
- Mitsubishi electric corporation (20240234218). METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on July 11th, 2024
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- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240203796). METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Samsung electronics co., ltd. (20240222199). DEVICE AND METHOD FOR SORTING SEMICONDUCTOR CHIP WITH POTENTIAL FAILURE RISK simplified abstract
- Samsung electronics co., ltd. (20240234215). APPARATUS FOR MEASURING AN ADHESION FORCE simplified abstract
- Samsung electronics co., ltd. (20240234216). METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER simplified abstract
- Samsung electronics co., ltd. (20240258178). METHOD OF DETECTING OVERLAY OF PATTERNS AND METHOD OF FORMING PATTERNS USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240304501). METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING A WAFER INSPECTION APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240332093). CRITICAL DIMENSION PREDICTION SYSTEM AND OPERATION METHOD THEREOF simplified abstract
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 4th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 3rd, 2024
- Samsung Electronics Co., Ltd. patent applications on September 12th, 2024
- SEMES CO., LTD. Patent Application Trends in 2024
- SHIN-ETSU HANDOTAI CO., LTD. Patent Application Trends in 2024
- SHINKAWA LTD. Patent Application Trends in 2024
- SUMCO CORPORATION Patent Application Trends in 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240258177). METHODS FOR CORRECTING WARPAGE WITH STRESS FILMS AND PACKAGE STRUCTURES THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240266232). SEMICONDUCTOR STRUCTURE INSPECTION USING A HIGH ATOMIC NUMBER MATERIAL simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321648). WAFER MANUFACTURING SYSTEM AND METHOD FOR MANUFACTURING WAFERS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347396). METHOD FOR MEASURING OVERLAY SHIFT OF BONDED WAFERS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379463). SYSTEMS FOR INSPECTION OF SEMICONDUCTOR SUBSTRATES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379464). APPARATUS AND METHODS FOR THREE DIMENSIONAL RETICLE DEFECT SMART REPAIR simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
- The University of Hong Kong Patent Application Trends in 2024
- Tokuyama Corporation Patent Application Trends in 2024
- TOKUYAMA CORPORATION Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025