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Category:CPC H01L21/76846
Pages in category "CPC H01L21/76846"
The following 47 pages are in this category, out of 47 total.
1
- 18131956. METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES simplified abstract (Applied Materials, Inc.)
- 18211502. SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION (Applied Materials, Inc.)
- 18444959. Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18583194. METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18733512. SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18979075. Method Of Forming A Metal Liner For Interconnect Structures (Applied Materials, Inc.)
A
- Adeia Semiconductor Solutions LLC Patent Application Trends in 2024
- Applied materials, inc. (20240339358). METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES simplified abstract
- Applied materials, inc. (20240420997). SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
- Applied materials, inc. (20250112090). Method Of Forming A Metal Liner For Interconnect Structures
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on October 10th, 2024
I
Q
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20250079238). METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240194525). Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240249977). METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240321632). SEMICONDUCTOR DEVICE INCLUDING LINER STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379422). FIELD EFFECT TRANSISTOR WITH MULTI-METAL GATE VIA AND METHOD simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379423). BARRIER LAYER FOR AN INTERCONNECT STRUCTURE simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024