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Category:B25J15/06
Subcategories
This category has the following 12 subcategories, out of 12 total.
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Pages in category "B25J15/06"
The following 43 pages are in this category, out of 43 total.
1
- 18078717. ROBOTIC SYSTEM FOR FREE-FORMING A WORKPIECE simplified abstract (GM GLOBAL TECHNOLOGY OPERATIONS LLC)
- 18089468. ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)
- 18090383. ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract (Intel Corporation)
- 18131064. VACUUM TIP ASSEMBLY FOR USE IN PICK-AND-PLACE TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18150690. Vacuum System End Effector simplified abstract (The Boeing Company)
- 18182002. GRIPPING ASSEMBLIES INCLUDING AN ADHESIVE ASSEMBLY simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18498207. Self-Sealing Suction Device (THE BOEING COMPANY)
- 18534742. ASSEMBLY METHOD FOR ELECTRONIC APPARATUS AND ASSEMBLY METHOD FOR PROJECTION DISPLAY APPARATUS simplified abstract (SEIKO EPSON CORPORATION)
- 18615580. GRIPPER APPARATUS FOR VEHICLE ASSEMBLY (HYUNDAI MOTOR COMPANY)
- 18615580. GRIPPER APPARATUS FOR VEHICLE ASSEMBLY (KIA CORPORATION)
- 18691068. CARRIER PLATFORM, DETECTION DEVICE AND BASE THEREFOR (BOE Technology Group Co., Ltd.)
- 18691068. CARRIER PLATFORM, DETECTION DEVICE AND BASE THEREFOR (Chengdu BOE OPtoelectronics Technology Co., Ltd.)
- 18774131. ROBOT AND ROBOTIC SYSTEM FOR REPLACING FINGERTIP (LG Electronics Inc.)
- 18929282. HIGH SPEED SUBSTRATE SORTER (Applied Materials, Inc.)
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- Intel corporation (20240213074). ENHANCED NOZZLE FOR DISAGGREGATED DIE HANDLING DURING THERMAL COMPRESSION BONDING simplified abstract
- Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 27th, 2024
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- Taiwan semiconductor manufacturing company, ltd. (20240335957). VACUUM TIP ASSEMBLY FOR USE IN PICK-AND-PLACE TOOL simplified abstract
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- Toyota jidosha kabushiki kaisha (20240286291). POSITION INSPECTION SYSTEM, COMPONENT ASSEMBLY SYSTEM, AND POSITION INSPECTION DEVICE simplified abstract
- TOYOTA JIDOSHA KABUSHIKI KAISHA patent applications on August 29th, 2024
- TOYOTA JIDOSHA KABUSHIKI KAISHA patent applications on February 20th, 2025