There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:B24B37/30
Subcategories
This category has the following 21 subcategories, out of 21 total.
A
C
E
H
J
M
P
S
T
Y
Pages in category "B24B37/30"
The following 21 pages are in this category, out of 21 total.
1
- 17887718. ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17959076. MEMBRANE FAILURE DETECTION SYSTEM simplified abstract (Applied Materials, Inc.)
- 17970434. GAS DELIVERY PALLET ASSEMBLY, CLEANING UNIT AND CHEMICAL MECHANICAL POLISHING SYSTEM HAVING THE SAME simplified abstract (Applied Materials, Inc.)
- 18373657. CMP INNER RING IN SMART HEAD (Applied Materials, Inc.)
- 18419867. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18436499. DEFORMABLE SUBSTRATE CHUCK simplified abstract (Applied Materials, Inc.)
- 18483971. HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE (Applied Materials, Inc.)
- 18483973. RETAINING-RING-LESS CMP PROCESS (Applied Materials, Inc.)
- 18518570. SUBSTRATE ROTATION PROCESSING DEVICE AND SUBSTRATE POLISHING DEVICE simplified abstract (EBARA CORPORATION)
- 18905005. HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRATE THICKNESS (Applied Materials, Inc.)
2
A
- Applied materials, inc. (20250100105). CMP INNER RING IN SMART HEAD
- Applied materials, inc. (20250114902). HORIZONTAL PRE-CLEAN 2-STAGE DOWNFORCE MECHANISM WITH FLEXURE
- Applied materials, inc. (20250114903). RETAINING-RING-LESS CMP PROCESS
- Applied materials, inc. (20250114910). HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRATE THICKNESS
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on March 27th, 2025