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Category:B23K1/00
Subcategories
This category has the following 20 subcategories, out of 20 total.
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Pages in category "B23K1/00"
The following 70 pages are in this category, out of 70 total.
1
- 18034768. VACUUM ADIABATIC BODY AND METHOD FOR MANUFACTURING THE SAME simplified abstract (LG ELECTRONICS INC.)
- 18101149. TWO PIECE HOLLOW-VANE ASSEMBLY JOINED VIA BRAZING simplified abstract (Raytheon Technologies Corporation)
- 18126858. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18127513. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18136416. SOLDER REFLOW APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18397354. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18410435. SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18454365. AMORPHOUS DUCTILE BRAZE ALLOY COMPOSITIONS, AND RELATED METHODS AND ARTICLES simplified abstract (General Electric Company)
- 18492383. DEVICES, SYSTEMS, AND METHODS FOR A CUTTING ELEMENT (Schlumberger Technology Corporation)
- 18495804. METAL COUPON WITH POROUS STRESS-RELIEF SECTION, COMPONENT WITH SAME AND RELATED METHOD (GE Infrastructure Technology LLC)
- 18495807. POROUS METAL COUPON WITH BRAZE MATERIAL INFILTRATION BARRIER FOR REPAIRING COMPONENT, COMPONENT WITH SAME AND RELATED METHOD (GE Infrastructure Technology LLC)
- 18495808. POROUS METAL COUPON WITH LOW POROSITY REGION FOR REPAIRING COMPONENT, COMPONENT WITH SAME AND RELATED METHOD (GE Infrastructure Technology LLC)
- 18495809. POROUS METAL COUPON WITH CONDUIT FOR REPAIRING COMPONENT, COMPONENT WITH SAME AND RELATED METHOD (GE Infrastructure Technology LLC)
- 18495810. POROUS METAL COUPON WITH THERMAL TRANSFER STRUCTURE FOR COMPONENT AND RELATED COMPONENT (GE Infrastructure Technology LLC)
- 18495811. METAL POROUS COUPON WITH ANCHOR FOR COMPONENT AND COMPONENT WITH SAME (GE Infrastructure Technology LLC)
- 18495812. BRAZE REPAIR USING METAL COUPON WITH POROUS REGION (GE Infrastructure Technology LLC)
- 18495814. METHOD OF USING METAL COUPON WITH POROUS REGION FOR COMPONENT (GE Infrastructure Technology LLC)
- 18495817. POROUS METAL COUPON WITH SEALED CAVITY FOR REPAIRING COMPONENT, COMPONENT WITH SAME AND RELATED METHOD (GE Infrastructure Technology LLC)
- 18495818. Metal Coupon With Porous Regions and Slanted Side Wall(s) for Turbomachine Component (GE Infrastructure Technology LLC)
- 18504549. Fabric with Electrical Components simplified abstract (Apple Inc.)
- 18509053. INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517457. SEMICONDUCTOR SUBSTRATE BONDING TOOL AND METHODS OF OPERATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18550317. ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE simplified abstract (PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.)
- 18576890. SOLDERING SYSTEM AND METHOD OF USE (Illinois Tool Works Inc.)
- 18601294. METHOD OF USING RESISTANCE SOLDERING DEVICE simplified abstract (Aptiv Technologies AG)
- 18608296. METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VARIATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18640164. SUBSTRATE PROCESSING APPARATUS (Samsung Electronics Co., Ltd.)
- 18745805. PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME simplified abstract (Dell Products L.P.)
- 18805678. COMPONENT-ATTACHED FPC MANUFACTURING METHOD (Yazaki Corporation)
- 18969497. CARTRIDGE FOR AN AEROSOL-GENERATING SYSTEM (Altria Client Services LLC)
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- Panasonic intellectual property management co., ltd. (20240268036). METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE simplified abstract
- Panasonic Intellectual Property Management Co., Ltd. patent applications on August 8th, 2024
- Pratt & Whitney Canada Corp. (20240293894). ADAPTIVE OVERHAUL USING PLURAL SCANNING METHODS simplified abstract
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- Samsung electronics co., ltd. (20240113067). SOLDER REFLOW APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240293884). SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract
- Samsung electronics co., ltd. (20250144730). SUBSTRATE PROCESSING APPARATUS
- Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
- Samsung Electronics Co., Ltd. patent applications on September 5th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 5th, 2024
- Schlumberger technology corporation (20250129673). DEVICES, SYSTEMS, AND METHODS FOR A CUTTING ELEMENT
- Schlumberger Technology Corporation patent applications on April 24th, 2025
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- Taiwan semiconductor manufacturing co., ltd. (20240222318). METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VARIATION simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250087625). SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan semiconductor manufacturing company, ltd. (20240375251). DIE BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- Toyota jidosha kabushiki kaisha (20250007035). HEAT EXCHANGER MANUFACTURING METHOD, HEAT EXCHANGER, POWER STORAGE DEVICE, AND POWER STORAGE DEVICE PACK
- TOYOTA JIDOSHA KABUSHIKI KAISHA patent applications on January 2nd, 2025