Pages that link to "Category:Xavier Francois Brun of Hillsboro OR US"

The following pages link to Category:Xavier Francois Brun of Hillsboro OR US:

Displaying 5 items.

• Intel corporation (20250006678). PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING (← links)
• Intel corporation (20250118698). MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS (← links)
• 18987884. MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS (Intel Corporation) (← links)
• Intel corporation (20250125307). MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS (← links)
• 18985540. MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS (Intel Corporation) (← links)