Category:Xavier Francois Brun of Hillsboro OR US
Xavier Francois Brun
Xavier Francois Brun from Hillsboro OR US has applied for patents in technology areas such as H01L23/00, H01L23/31, H01L23/544 with intel corporation.
Patents
Pages in category "Xavier Francois Brun of Hillsboro OR US"
The following 5 pages are in this category, out of 5 total.
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- Intel corporation (20250006678). PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING
- Intel corporation (20250118698). MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS
- Intel corporation (20250125307). MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS