Qualcomm incorporated (20250125234). INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
Organization Name
Inventor(s)
Manuel Aldrete of Encinitas CA US
Rajneesh Kumar of San Diego CA US
Zhijie Wang of San Diego CA US
Aniket Patil of San Diego CA US
Srikanth Kulkarni of Pleasanton CA US
INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
This abstract first appeared for US patent application 20250125234 titled 'INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
Original Abstract Submitted
in an aspect, an integrated circuit (ic) package includes a base structure, an ic component disposed on the base structure, a plurality of interposer connection structures disposed on the base structure, and an interposer structure disposed over the ic component and the plurality of interposer connection structures. the plurality of interposer connection structures is configured to connect the base structure and the interposer structure. each interposer connection structure of the plurality of interposer connection structures includes a bond ball portion that is connected to the base structure, and a bond wire portion that is coupled to the bond ball portion and extends toward the interposer structure. a width of the bond ball portion is greater than a width of the bond wire portion.