Category:Zhijie Wang of San Diego CA US
Zhijie Wang
Zhijie Wang from San Diego CA US has applied for patents in technology areas such as H01L23/13, H01L23/00, H01L23/31 with qualcomm incorporated.
Patents
Pages in category "Zhijie Wang of San Diego CA US"
The following 10 pages are in this category, out of 10 total.
1
- 18470148. PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK (QUALCOMM Incorporated)
- 18471069. PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE (QUALCOMM Incorporated)
- 18486970. INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING (QUALCOMM Incorporated)
- 18605481. INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING (QUALCOMM Incorporated)
- 18649229. DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES (QUALCOMM Incorporated)
Q
- Qualcomm incorporated (20250096051). PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE
- Qualcomm incorporated (20250098066). PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK
- Qualcomm incorporated (20250125234). INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
- Qualcomm incorporated (20250125244). INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
- Qualcomm incorporated (20250132262). DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES