Category:Manuel Aldrete of Encinitas CA US
Manuel Aldrete
Manuel Aldrete from Encinitas CA US has applied for patents in technology areas such as H01L23/13, H01L23/00, H01L23/31 with qualcomm incorporated.
Patents
Pages in category "Manuel Aldrete of Encinitas CA US"
The following 6 pages are in this category, out of 6 total.
1
- 18471069. PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE (QUALCOMM Incorporated)
- 18486970. INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING (QUALCOMM Incorporated)
- 18605481. INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING (QUALCOMM Incorporated)
Q
- Qualcomm incorporated (20250096051). PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE
- Qualcomm incorporated (20250125234). INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
- Qualcomm incorporated (20250125244). INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING