Category:Sang-Jae Lee of San Diego CA (US)
Sang-Jae Lee
Sang-Jae Lee from San Diego CA (US) has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L25/16 with qualcomm incorporated.
Patents
Pages in category "Sang-Jae Lee of San Diego CA (US)"
The following 7 pages are in this category, out of 7 total.
1
Q
- Qualcomm incorporated (20240194545). METAL POCKET FANOUT PACKAGE simplified abstract
- Qualcomm incorporated (20240274516). INTERPOSER WITH SOLDER RESIST POSTS simplified abstract
- Qualcomm incorporated (20240321752). PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract
- Qualcomm incorporated (20250062235). PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDITIONAL METAL PAD LAYER TO FACILITATE REDUCED VIA SIZE FOR REDUCED BUMP PITCH, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
- Qualcomm incorporated (20250062246). STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE