Intel corporation (20250118647). NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE
NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE
Organization Name
Inventor(s)
Srinivas V. Pietambaram of Chandler AZ US
Debendra Mallik of Chandler AZ US
Kristof Darmawikarta of Chandler AZ US
Ravindranath V. Mahajan of Chandler AZ US
Rahul N. Manepalli of Chandler AZ US
NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE
This abstract first appeared for US patent application 20250118647 titled 'NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE
Original Abstract Submitted
an electronic package includes an interposer having an interposer substrate, a cavity that passes into but not through the interposer substrate, a through interposer via (tiv) within the interposer substrate, and an interposer pad electrically coupled to the tiv. the electronic package includes a nested component in the cavity, wherein the nested component includes a component pad coupled to a through-component via. a core via is beneath the nested component, the core via extending from the nested component through the interposer substrate. a die is coupled to the interposer pad by a first interconnect and coupled to the component pad by a second interconnect.