Category:Kristof Darmawikarta of Chandler AZ US
Kristof Darmawikarta
Kristof Darmawikarta from Chandler AZ US has applied for patents in technology areas such as H01L23/498, H01L21/48, H01L23/00 with intel corporation.
Patents
Pages in category "Kristof Darmawikarta of Chandler AZ US"
The following 11 pages are in this category, out of 11 total.
1
- 18988225. NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE (Intel Corporation)
- 18999978. MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS (Intel Corporation)
- 19000025. PANEL LEVEL PACKAGING FOR MULTI-DIE PRODUCTS INTERCONNECTED WITH VERY HIGH DENSITY (VHD) INTERCONNECT LAYERS (Intel Corporation)
2
I
- Intel corporation (20240258240). DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
- Intel corporation (20250006616). HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES
- Intel corporation (20250006781). CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Intel corporation (20250118647). NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE
- Intel corporation (20250125275). MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
- Intel corporation (20250125277). PANEL LEVEL PACKAGING FOR MULTI-DIE PRODUCTS INTERCONNECTED WITH VERY HIGH DENSITY (VHD) INTERCONNECT LAYERS