Category:Zhiyuan YE of San Jose CA (US)

Zhiyuan YE of San Jose CA (US)

Executive Summary

Zhiyuan YE of San Jose CA (US) is an inventor who has filed 4 patents. Their primary areas of innovation include SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds, (2 patents), COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion (1 patents), {taking account of the properties of the material involved ( (1 patents), and they have worked with companies such as Applied Materials, Inc. (4 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• C30B25/08 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 2 patents
• C23C16/46 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• B23K26/0006 ({taking account of the properties of the material involved (): 1 patents
• B23K26/032 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B23K26/034 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B23K26/0604 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B23K26/08 (Devices involving relative movement between laser beam and workpiece): 1 patents
• B23K26/123 (in a special atmosphere, e.g. in an enclosure): 1 patents
• B23K26/126 ({in an atmosphere of gases chemically reacting with the workpiece}): 1 patents
• B23K26/127 (in a special atmosphere, e.g. in an enclosure): 1 patents
• B23K26/128 (in a special atmosphere, e.g. in an enclosure): 1 patents
• B23K26/352 (for surface treatment): 1 patents
• C23C16/52 (Controlling or regulating the coating process {(): 1 patents
• H01L21/67115 ({mainly by radiation}): 1 patents
• H01L21/6719 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67248 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/68742 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01L21/68764 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01L21/68785 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01L21/68757 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01L22/26 ({Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement (endpoint detection arrangements in CMP apparatus): 1 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/02636 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• C30B25/18 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
• C30B33/02 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
• C30B33/12 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
• C30B35/00 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
• H01L21/02532 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/3065 (Plasma etching; Reactive-ion etching): 1 patents
• H01L21/324 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• C30B29/06 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
• Y10T117/10 (No explanation available): 1 patents
• C30B25/14 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
• H01L21/67 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents

Companies

List of Companies

• Applied Materials, Inc.: 4 patents

Collaborators

• Shu-Kwan LAU of Sunnyvale CA (US) (3 collaborations)
• Errol Antonio C. SANCHEZ of Tracy CA (US) (3 collaborations)
• Schubert S. CHU of San Francisco CA (US) (3 collaborations)
• Zuoming ZHU of Sunnyvale CA (US) (2 collaborations)
• Brian Hayes BURROWS of San Jose CA (US) (2 collaborations)
• Koji NAKANISHI (1 collaborations)
• Toshiyuki NAKAGAWA (1 collaborations)
• Joseph M. RANISH of San Jose CA (US) (1 collaborations)
• Nyi Oo MYO of San Jose CA (US) (1 collaborations)
• Ala MORADIAN of Sunnyvale CA (US) (1 collaborations)
• Enle CHOO of Saratoga CA (US) (1 collaborations)
• Flora Fong-Song CHANG of Saratoga CA (US) (1 collaborations)
• Vilen K. NESTOROV of Pleasanton CA (US) (1 collaborations)
• Bindusagar MARATH SANKARATHODI of San Jose CA (US) (1 collaborations)
• Maxim D. SHAPOSHNIKOV of Sunnyvale CA (US) (1 collaborations)
• Surendra Singh SRIVASTAVA of Santa Clara CA (US) (1 collaborations)
• Zhepeng CONG of San Jose CA (US) (1 collaborations)
• Patricia M. LIU of Saratoga CA (US) (1 collaborations)
• Jenny C. LIN of Saratoga CA (US) (1 collaborations)
• Balakrishnam R. JAMPANA of San Jose CA (US) (1 collaborations)
• Chen-Ying WU of Santa Clara CA (US) (1 collaborations)
• Yi-Chiau HUANG of Fremont CA (US) (1 collaborations)
• Richard O. COLLINS of Santa Clara CA (US) (1 collaborations)