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Category:Robert A. May of Chandler AZ US

From WikiPatents

Robert A. May

Robert A. May from Chandler AZ US has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L21/56 with intel corporation.

Patents

MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS (20250125275)

Pages in category "Robert A. May of Chandler AZ US"

The following 5 pages are in this category, out of 5 total.

1

18999978. MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS (Intel Corporation)
19000025. PANEL LEVEL PACKAGING FOR MULTI-DIE PRODUCTS INTERCONNECTED WITH VERY HIGH DENSITY (VHD) INTERCONNECT LAYERS (Intel Corporation)

2

20250218915. Pedestal Structure Passi (Intel)

I

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