Category:Pushkar Sharad Ranade of San Jose CA (US)
Pushkar Sharad Ranade
Pushkar Sharad Ranade from San Jose CA (US) has applied for patents in technology areas such as H01L23/473, H01L23/00, H01L23/498 with intel corporation.
Patents
Subcategories
This category has the following 5 subcategories, out of 5 total.
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Pages in category "Pushkar Sharad Ranade of San Jose CA (US)"
The following 21 pages are in this category, out of 21 total.
1
- 17846086. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17846109. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES AND MULTI-SIDE ROUTING simplified abstract (Intel Corporation)
- 17846129. PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17846173. PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17930825. FULL WAFER DEVICE WITH FRONT SIDE PASSIVE ELECTRONIC COMPONENTS simplified abstract (Intel Corporation)
- 17933589. HYBRID MANUFACTURING OF ACCESS TRANSISTORS FOR MEMORY simplified abstract (Intel Corporation)
- 18148528. PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (Intel Corporation)
- 18148533. PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (Intel Corporation)
- 18148543. PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (Intel Corporation)
- 18312847. STATIC RANDOM-ACCESS MEMORY DEVICES WITH ANGLED TRANSISTORS simplified abstract (Intel Corporation)
- 18314862. LOGIC CIRCUITS USING VERTICAL TRANSISTORS WITH BACKSIDE SOURCE OR DRAIN REGIONS simplified abstract (Intel Corporation)
- 18314875. INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS AND ANGLED ROUTING TRACKS simplified abstract (Intel Corporation)
I
- Intel corporation (20240105596). INTEGRATED CIRCUIT DEVICES WITH ANGLED INTERCONNECTS simplified abstract
- Intel corporation (20240222321). PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract
- Intel corporation (20240222326). PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract
- Intel corporation (20240222328). PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract
- Intel corporation (20250062278). PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH SOLDER INTERCONNECTS
- Intel corporation (20250079263). PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH A COOLING MICROCHANNEL
- Intel corporation (20250079398). PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AND VOLTAGE REGULATORS
- Intel corporation (20250079399). PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES AS A SOLID STATE BATTERY