Category:Paul Packan of Hillsboro OR US
Paul Packan
Paul Packan from Hillsboro OR US has applied for patents in technology areas such as H01L27/092, H01L29/06, H01L29/10 with intel corporation.
Patents
Pages in category "Paul Packan of Hillsboro OR US"
The following 8 pages are in this category, out of 8 total.
1
- 18372506. INTEGRATED CIRCUIT STRUCTURES HAVING REDUCED LOCAL LAYOUT EFFECTS (Intel Corporation)
- 18374607. MULTIPLE VOLTAGE THRESHOLD INTEGRATED CIRCUIT STRUCTURE WITH LOCAL LAYOUT EFFECT TUNING (INTEL CORPORATION)
- 18375084. INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING (INTEL CORPORATION)
I
- Intel corporation (20250006734). PERFORMANCE OPTIMIZATION OF TRANSISTORS SHARING CHANNEL STRUCTURES OF VARYING WIDTH
- Intel corporation (20250107175). INTEGRATED CIRCUIT STRUCTURES HAVING REDUCED LOCAL LAYOUT EFFECTS
- Intel corporation (20250112120). INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING
- Intel corporation (20250113595). MULTIPLE VOLTAGE THRESHOLD INTEGRATED CIRCUIT STRUCTURE WITH LOCAL LAYOUT EFFECT TUNING