PHOTONIC OPTICAL FIBER PACKAGING

Organization Name

International Business Machines Corporation

Inventor(s)

Nicholas Alexander Polomoff of Hopewell Junction NY (US)

Nicholas Latham of Albany NY (US)

Junwon Han of Loudonville NY (US)

Kishan Jayanand of Cohoes NY (US)

Mary Mcgahay of Troy NY (US)

Sathyanarayanan Raghavan of Ballston Lake NY (US)

Aakrati Jain of Albany NY (US)

PHOTONIC OPTICAL FIBER PACKAGING

This abstract first appeared for US patent application 18342127 titled 'PHOTONIC OPTICAL FIBER PACKAGING

Original Abstract Submitted

A lid for a photonic device includes a resilient frame configured to bridge transversely over one or more optical fibers in a region of the photonic device. The resilient frame includes a span that defines a span direction, the resilient frame further includes end portions that are disposed transversely to the span to form an internal region of the frame. A compliant solid base material is formed within the internal region of the frame and attached to the frame along the span. The resilient frame is configured to transversely span over one or more optical fibers and preload the one or more optical fibers with the compliant solid base material when secured to the photonic device.