Jump to content

Category:Michael Crocker of Portland OR (US)

From WikiPatents

Michael Crocker

Michael Crocker from Portland OR (US) has applied for patents in technology areas such as H01L25/065, H01L23/00, H01L23/522 with intel corporation.

Patents

PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH SOLDER INTERCONNECTS (20250062278)

Subcategories

This category has the following 5 subcategories, out of 5 total.

A

► Abhishek A. Sharma of Portland OR (US)‎ (5 C, 13 P)

D

► Debendra Mallik of Chandler AZ (US)‎ (6 C, 38 P)

N

► Nitin A. Deshpande of Chandler AZ (US)‎ (6 C, 21 P)

S

► Sagar Suthram of Portland OR (US)‎ (5 C, 69 P)

W

► Wilfred Gomes of Portland OR (US)‎ (5 C, 83 P)

Pages in category "Michael Crocker of Portland OR (US)"

The following 4 pages are in this category, out of 4 total.

1

17846086. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)

I

Retrieved from "http://wikipatents.org/index.php?title=Category:Michael_Crocker_of_Portland_OR_(US)&oldid=340043"

Cookies help us deliver our services. By using our services, you agree to our use of cookies.