Marcel Said

Marcel Said from Beaverton OR US has applied for patents in technology areas such as [[:Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })|the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]] with Intel Corporation.

Patents

• METHODS AND APPARATUS TO FACILITATE SEMICONDUCTOR DEVICE ALIGNMENT IN AN INTEGRATED CIRCUIT PACKAGE (20250218961)

[[Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]]