Category:Johanna M. Swan of Scottsdale AZ (US)
Johanna M. Swan
Johanna M. Swan from Scottsdale AZ (US) has applied for patents in technology areas such as H01L25/065, H01L23/498, H01L25/00 with intel corporation.
Patents
Subcategories
This category has the following 2 subcategories, out of 2 total.
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Pages in category "Johanna M. Swan of Scottsdale AZ (US)"
The following 15 pages are in this category, out of 15 total.
1
- 18344260. PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING (Intel Corporation)
- 18397873. MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18597684. MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract (Intel Corporation)
- 18746188. DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18942054. MICROELECTRONIC ASSEMBLIES (Intel Corporation)
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- Intel corporation (20240128255). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240136323). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240213216). MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240274576). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240339410). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240355750). MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract
- Intel corporation (20240355768). MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS simplified abstract
- Intel corporation (20240429173). MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME
- Intel corporation (20250070083). MICROELECTRONIC ASSEMBLIES