Intel corporation (20240128255). MICROELECTRONIC ASSEMBLIES simplified abstract
MICROELECTRONIC ASSEMBLIES
Organization Name
Inventor(s)
Adel A. Elsherbini of Tempe AZ (US)
Shawna M. Liff of Scottsdale AZ (US)
Johanna M. Swan of Scottsdale AZ (US)
Arun Chandrasekhar of Chandler AZ (US)
MICROELECTRONIC ASSEMBLIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128255 titled 'MICROELECTRONIC ASSEMBLIES
Simplified Explanation
The abstract describes a microelectronic assembly with a package substrate and a die secured to the substrate using non-solder interconnects.
- Package substrate with first and second surfaces
- Die with first and second surfaces, conductive contacts, and non-solder interconnects
- First conductive contacts in the die connected to pathways in the package substrate
Potential Applications
This technology could be used in:
- Consumer electronics
- Automotive electronics
- Medical devices
Problems Solved
- Improved reliability of microelectronic assemblies
- Enhanced electrical connectivity
- Reduced risk of thermal damage
Benefits
- Increased durability
- Enhanced performance
- Cost-effective manufacturing
Potential Commercial Applications
Optimizing Microelectronic Assemblies for Improved Performance
Possible Prior Art
Prior art in microelectronic assemblies using solder interconnects for die attachment.
Unanswered Questions
How does this technology impact the overall size of the microelectronic assembly?
The abstract does not provide information on whether this technology affects the size of the assembly.
What is the expected lifespan of microelectronic assemblies using non-solder interconnects?
The abstract does not mention the expected lifespan of assemblies utilizing this technology.
Original Abstract Submitted
microelectronic assemblies, and related devices and methods, are disclosed herein. for example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.
