Category:Joan Rey Villarba Buot of Escondido CA US
Joan Rey Villarba Buot
Joan Rey Villarba Buot from Escondido CA US has applied for patents in technology areas such as H01L23/498, H01L21/48, H01L23/00 with qualcomm incorporated.
Patents
Pages in category "Joan Rey Villarba Buot of Escondido CA US"
The following 12 pages are in this category, out of 12 total.
1
- 18467163. PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK (QUALCOMM Incorporated)
- 18470148. PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK (QUALCOMM Incorporated)
- 18470250. PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL WALLS (QUALCOMM Incorporated)
- 18491084. DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES (QUALCOMM Incorporated)
- 18494115. SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE (QUALCOMM Incorporated)
- 18649229. DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES (QUALCOMM Incorporated)
Q
- Qualcomm incorporated (20250096091). PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL WALLS
- Qualcomm incorporated (20250096111). PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK
- Qualcomm incorporated (20250098066). PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK
- Qualcomm incorporated (20250132262). DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES
- Qualcomm incorporated (20250132292). DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES
- Qualcomm incorporated (20250140700). SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE