18494115. SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE (QUALCOMM Incorporated)
SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE
Organization Name
Inventor(s)
Joan Rey Villarba Buot of Escondido CA US
Hong Bok We of San Diego CA US
Michelle Yejin Kim of Carlsbad CA US
Aniket Patil of San Diego CA US
Yu-Ting Huang of Taoyuan Dist, Taoyuan City TW
SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE
This abstract first appeared for US patent application 18494115 titled 'SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE
Original Abstract Submitted
In an aspect, a substrate for an integrated circuit (IC) package includes a first dielectric layer, a first metallization layer on a first surface of the first dielectric layer and including a first pad structure and a first trace structure, a second metallization layer on a second surface of the first dielectric layer and including a second pad structure and a second trace structure, a second dielectric layer on the second surface of the first dielectric layer, and a third metallization layer on a second surface of the second dielectric layer and having a third pad structure. The substrate further includes a conductive stud coupled to the second pad structure and a second via structure embedded in the second dielectric layer. The second via structure has a first end coupled to the conductive stud and a second end coupled to the third pad structure.