18373879. N-BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURE (Intel Corporation)
N-BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURE
Organization Name
Inventor(s)
Alexander W. Huettis of Hillsboro OR US
Patrick Nardi of Scottsdale AZ US
Andrew W. Carlson of Chandler AZ US
N-BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURE
This abstract first appeared for US patent application 18373879 titled 'N-BALL SECOND LEVEL INTERCONNECT PACKAGE ARCHITECTURE
Original Abstract Submitted
Embodiments disclosed herein include systems with interconnects that comprise four or more different interconnect types. In an embodiment, an apparatus comprises a substrate and a ball grid array across a surface of the substrate. In an embodiment, the ball grid array comprises first interconnects in a first region of the ball grid array, second interconnects in a second region of the ball grid array, third interconnects in a third region of the ball grid array, and fourth interconnects in a fourth region of the ball grid array. In an embodiment, the first interconnects, the second interconnects, the third interconnects, and the fourth interconnects all have a difference in one or more of a composition, a dimension, and a structure.