Category:Jeremy D. Ecton of Gilbert AZ (US)
Jeremy D. Ecton
Jeremy D. Ecton from Gilbert AZ (US) has applied for patents in technology areas such as H01L23/538, H01L23/498, H01L23/522 with intel corporation.
Patents
Pages in category "Jeremy D. Ecton of Gilbert AZ (US)"
The following 55 pages are in this category, out of 55 total.
1
- 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
- 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 17943354. TECHNOLOGIES FOR GLASS CORE INDUCTOR simplified abstract (Intel Corporation)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation)
- 17956757. PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract (Intel Corporation)
- 17957003. HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract (Intel Corporation)
- 17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17958053. METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract (Intel Corporation)
- 17988051. BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18059923. PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE simplified abstract (Intel Corporation)
- 18071116. RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract (Intel Corporation)
- 18071237. GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract (Intel Corporation)
- 18086265. LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18086293. GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract (Intel Corporation)
- 18088360. CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract (Intel Corporation)
- 18089801. GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract (Intel Corporation)
- 18089916. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)
- 18091022. ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES simplified abstract (Intel Corporation)
- 18091026. ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES simplified abstract (Intel Corporation)
- 18091560. TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 18091583. TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract (Intel Corporation)
- 18130582. AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18147457. ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER simplified abstract (Intel Corporation)
- 18148355. INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES simplified abstract (Intel Corporation)
- 18215427. CONDITIONING SEMICONDUCTOR PROCESSING SOLUTIONS FOR REUSE (Intel Corporation)
- 18465779. EMBEDDED ORGANIC BRIDGE COMPONENT FOR SEMICONDUCTOR PACKAGES (Intel Corporation)
I
- Intel corporation (20240101413). SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES simplified abstract
- Intel corporation (20240105571). IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS simplified abstract
- Intel corporation (20240111092). PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract
- Intel corporation (20240112972). MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract
- Intel corporation (20240112973). METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract
- Intel corporation (20240113158). HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract
- Intel corporation (20240162157). BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract
- Intel corporation (20240176084). PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE simplified abstract
- Intel corporation (20240177918). GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract
- Intel corporation (20240178119). RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract
- Intel corporation (20240186227). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240186228). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240186250). Microelectronic Assembly Including Interconnect Bridges with Through Vias Embedded Therein simplified abstract
- Intel corporation (20240186270). MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN simplified abstract
- Intel corporation (20240203806). GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA simplified abstract
- Intel corporation (20240213111). CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract
- Intel corporation (20240213169). LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract
- Intel corporation (20240213170). GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract
- Intel corporation (20240219655). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract
- Intel corporation (20240222130). ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES simplified abstract
- Intel corporation (20240222137). ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES simplified abstract
- Intel corporation (20240222248). ARCHITECTURES AND METHODS FOR METAL LAMINATION ON A GLASS LAYER simplified abstract
- Intel corporation (20240222249). INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER HAVING ROUGHENED SURFACES simplified abstract
- Intel corporation (20240222257). GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract
- Intel corporation (20240222279). TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240222298). TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract
- Intel corporation (20240339381). AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER simplified abstract
- Intel corporation (20250087587). EMBEDDED ORGANIC BRIDGE COMPONENT FOR SEMICONDUCTOR PACKAGES