Intel corporation (20250087587). EMBEDDED ORGANIC BRIDGE COMPONENT FOR SEMICONDUCTOR PACKAGES
EMBEDDED ORGANIC BRIDGE COMPONENT FOR SEMICONDUCTOR PACKAGES
Organization Name
Inventor(s)
Jeremy D. Ecton of Gilbert AZ (US)
EMBEDDED ORGANIC BRIDGE COMPONENT FOR SEMICONDUCTOR PACKAGES
This abstract first appeared for US patent application 20250087587 titled 'EMBEDDED ORGANIC BRIDGE COMPONENT FOR SEMICONDUCTOR PACKAGES
Original Abstract Submitted
architectures and process flows for an embedded organic bridge component for semiconductor packages. the bulk of the substrate package fabrication can be done using conventional processing steps to meet core geometries (e.g., 9/12) with associated equipment and clean room protocols. separately the organic bridge component is fabricated to embed into the substrate package at a location where the high-speed input/output (i/o) performance and high-density (hd) geometry are required. the organic bridge component is fabricated as required to meet the hd geometry (e.g., 3/3, or less). during assembly, the embedded organic bridge component can be attached into a cavity in the substrate package.