Jump to content

Category:Harini Kilambi of Portland OR US

From WikiPatents

Harini Kilambi

Harini Kilambi from Portland OR US has applied for patents in technology areas such as H01L23/00, H01L23/31, H01L23/544 with intel corporation.

Patents

PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING (20250006678)

Pages in category "Harini Kilambi of Portland OR US"

The following 3 pages are in this category, out of 3 total.

1

18477813. HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS (INTEL CORPORATION)

I

Retrieved from "https://wikipatents.org/index.php?title=Category:Harini_Kilambi_of_Portland_OR_US&oldid=367397"

Cookies help us deliver our services. By using our services, you agree to our use of cookies.