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Category:Feng Zhang of Hillboro OR US

From WikiPatents

Feng Zhang

Feng Zhang from Hillboro OR US has applied for patents in technology areas such as H01L23/522, H01L23/528 with intel corporation.

Patents

VIA STRUCTURE WITH IMPROVED SUBSTRATE GROUNDING (20250096114)

Pages in category "Feng Zhang of Hillboro OR US"

The following 4 pages are in this category, out of 4 total.

1

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Intel corporation (20250096114). VIA STRUCTURE WITH IMPROVED SUBSTRATE GROUNDING
Intel corporation (20250098260). INTEGRATED CIRCUIT STRUCTURES WITH PATCH SPACERS

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