Category:Dun-Nian Yaung of Taipei City TW
Dun-Nian Yaung
Dun-Nian Yaung from Taipei City TW has applied for patents in technology areas such as H01L27/146, H04N25/77 with taiwan semiconductor manufacturing co., ltd..
Patents
Pages in category "Dun-Nian Yaung of Taipei City TW"
The following 21 pages are in this category, out of 21 total.
1
- 18401771. HIGH PERFORMANCE STACKING PIXEL (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18406526. STACKED CMOS IMAGE SENSOR COMPRISING A PIXEL SENSOR FOR HIGH CONVERSION GAIN AND METHOD FOR FORMING THE SAME (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18486382. SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18488071. INTEGRATED CIRCUIT FABRICATION EMPLOYING SELF-ALIGNED MASK (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18969408. IMAGE SENSOR HAVING A GATE DIELECTRIC STRUCTURE FOR IMPROVED DEVICE SCALING (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18973288. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19008802. BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 19014368. SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS) (Taiwan Semiconductor Manufacturing Company, Ltd.)
2
- 20250185400. Image Sensor Overlap Backside Trench Isolation Structure Vertical Transfer G (Taiwan Semiconductor Manufacturing , .)
- 20250218900. Through Substrate Via Spaced Shallow Trench Isolat (Taiwan Semiconductor Manufacturing , .)
- 20250219016. Semiconductor Structure Manufacturing Method Ther (Taiwan Semiconductor Manufacturing , .)
- 20250221067. Image Sensor Method Manufacturing S (Taiwan Semiconductor Manufacturing , .)
T
- Taiwan semiconductor manufacturing co., ltd. (20250098353). IMAGE SENSOR HAVING A GATE DIELECTRIC STRUCTURE FOR IMPROVED DEVICE SCALING
- Taiwan semiconductor manufacturing co., ltd. (20250105098). OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Taiwan semiconductor manufacturing co., ltd. (20250126812). INTEGRATED CIRCUIT FABRICATION EMPLOYING SELF-ALIGNED MASK
- Taiwan semiconductor manufacturing co., ltd. (20250126915). SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250014987). INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING STRUCTURE
- Taiwan semiconductor manufacturing company, ltd. (20250142232). STACKED CMOS IMAGE SENSOR COMPRISING A PIXEL SENSOR FOR HIGH CONVERSION GAIN AND METHOD FOR FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250143001). HIGH PERFORMANCE STACKING PIXEL
- Taiwan semiconductor manufacturing company, ltd. (20250149407). SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Taiwan semiconductor manufacturing company, ltd. (20250149509). BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES