18401771. HIGH PERFORMANCE STACKING PIXEL (Taiwan Semiconductor Manufacturing Company, Ltd.)
HIGH PERFORMANCE STACKING PIXEL
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsin-Hung Chen of Tainan City TW
Feng-Chi Hung of Chu-Bei City TW
Jen-Cheng Liu of Hsin-Chu City TW
Dun-Nian Yaung of Taipei City TW
HIGH PERFORMANCE STACKING PIXEL
This abstract first appeared for US patent application 18401771 titled 'HIGH PERFORMANCE STACKING PIXEL
Original Abstract Submitted
The present disclosure relates to a multi-dimensional image sensor integrated chip (IC) structure. The multi-dimensional image sensor IC structure includes a plurality of image sensing elements disposed within a plurality of pixel regions arranged in a pixel array of a first integrated chip (IC) tier. The plurality of pixel regions include a plurality of active pixel regions and one or more dummy pixel regions. A plurality of pixel support devices are disposed on a second substrate within a second IC tier that is bonded to the first IC tier. A plurality of logic devices are disposed within a third IC tier that is bonded to the second IC tier. A through substrate via (TSV) extends vertically through the second substrate laterally outside of the plurality of pixel support devices and directly below the pixel array.