Category:Akshay N. Singh of Boise ID US
Akshay N. Singh
Akshay N. Singh from Boise ID US has applied for patents in technology areas such as H01L23/00, H01L21/304, H01L21/683 with micron technology, inc..
Patents
Pages in category "Akshay N. Singh of Boise ID US"
The following 10 pages are in this category, out of 10 total.
1
- 18776197. TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITECTURES (MICRON TECHNOLOGY, INC.)
- 18788541. STACKED SEMICONDUCTOR DEVICE (Micron Technology, Inc.)
- 18789049. METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESULTING FROM SUCH METHODS (Micron Technology, Inc.)
- 18920749. STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE (Micron Technology, Inc.)
2
M
- Micron technology, inc. (20250096171). METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESULTING FROM SUCH METHODS
- Micron technology, inc. (20250096202). STACKED SEMICONDUCTOR DEVICE
- Micron technology, inc. (20250118693). TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITECTURES
- Micron technology, inc. (20250140753). STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE