New pages
Jump to navigation
Jump to search
(newest | oldest) View (newer 20 | older 20) (20 | 50 | 100 | 250 | 500)
- 04:17, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136280). Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract (hist) [4,525 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Micron technology, inc. (20240130121). MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS simplified abstract (hist) [3,264 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136251). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [3,908 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Micron technology, inc. (20240129114). DYNAMIC COMMAND EXTENSION FOR A MEMORY SUB-SYSTEM simplified abstract (hist) [4,168 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136246). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [4,179 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Micron technology, inc. (20240128426). VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANSDUCERS HAVING BURIED CONTACTS AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (hist) [4,709 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136228). Ion Implantation For Nano-FET simplified abstract (hist) [3,750 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136227). Barrier-Free Approach for Forming Contact Plugs simplified abstract (hist) [3,942 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Micron technology, inc. (20240128425). SOLID STATE LIGHTING DEVICES WITH IMPROVED CONTACTS AND ASSOCIATED METHODS OF MANUFACTURING simplified abstract (hist) [3,443 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136226). SEMICONDUCTOR DEVICE PRE-CLEANING simplified abstract (hist) [4,658 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:17, 26 April 2024 Micron technology, inc. (20240128396). LIGHT EMITTING DIODES WITH N-POLARITY AND ASSOCIATED METHODS OF MANUFACTURING simplified abstract (hist) [3,456 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:16, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136222). Different Isolation Liners for Different Type FinFETs and Associated Isolation Feature Fabrication simplified abstract (hist) [4,339 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:16, 26 April 2024 Micron technology, inc. (20240128207). NAND FLASH BLOCK ARCHITECTURE ENHANCEMENT TO PREVENT BLOCK LIFTING simplified abstract (hist) [4,457 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:16, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136221). INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP simplified abstract (hist) [4,147 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:16, 26 April 2024 Micron technology, inc. (20240128189). ANTIFUSE DEVICE HAVING INTERCONNECT JUMPER simplified abstract (hist) [2,709 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:16, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136220). Shallow Trench Isolation Forming Method and Structures Resulting Therefrom simplified abstract (hist) [3,705 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:16, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136213). MODULAR PRESSURIZED WORKSTATION simplified abstract (hist) [4,482 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:16, 26 April 2024 Micron technology, inc. (20240128182). DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN simplified abstract (hist) [3,774 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:16, 26 April 2024 Taiwan semiconductor manufacturing company, ltd. (20240136203). PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME simplified abstract (hist) [4,028 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:16, 26 April 2024 Micron technology, inc. (20240128163). SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract (hist) [4,371 bytes] Wikipatents (talk | contribs) (Creating a new page)