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- 06:36, 26 April 2024 18230539. DISPLAY DEVICE INCLUDING A TEST PIXEL simplified abstract (Samsung Display Co., LTD.) (hist) [3,847 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:36, 26 April 2024 18401893. LOCAL OSCILLATOR (LO) GENERATION FOR CARRIER AGGREGATION IN PHASED ARRAY FRONT ENDS simplified abstract (Intel Corporation) (hist) [4,075 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:36, 26 April 2024 18109710. MACHINE LEARNING SYSTEMS AND METHODS FOR CLASSIFICATION simplified abstract (Samsung Display Co., LTD.) (hist) [4,061 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:36, 26 April 2024 17970477. SAMPLING FRACTIONAL-N PHASE-LOCKED LOOP WITH FEEDBACK SPUR COMPENSATION simplified abstract (Intel Corporation) (hist) [4,184 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:36, 26 April 2024 18535708. ELECTRONIC APPARATUS simplified abstract (Samsung Display Co., LTD.) (hist) [3,791 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:36, 26 April 2024 17971619. ADAPTIVE CLOCK GATING FOR IMPROVING WEAR OUT-INDUCED DUTY CYCLE SHIFT IN COMPUTER CLOCK NETWORK simplified abstract (Intel Corporation) (hist) [3,193 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:36, 26 April 2024 18486290. DISPLAY PANEL AND ELECTRONIC APPARATUS INCLUDING THE SAME simplified abstract (Samsung Display Co., LTD.) (hist) [3,463 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18399189. NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract (Intel Corporation) (hist) [4,676 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18450576. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.) (hist) [3,632 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18400761. MICROELECTRONIC STRUCTURES INCLUDING BRIDGES simplified abstract (Intel Corporation) (hist) [2,865 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18488462. DISPLAY APPARATUS simplified abstract (Samsung Display Co., LTD.) (hist) [2,768 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 17972975. INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract (Intel Corporation) (hist) [3,938 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18333707. DISPLAY DEVICE AND PANEL STORAGE CONTAINER simplified abstract (Samsung Display Co., LTD.) (hist) [3,666 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18400784. STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract (Intel Corporation) (hist) [3,660 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18222805. WINDOW MODULE AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract (Samsung Display Co., LTD.) (hist) [3,534 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18395192. TOP GATE RECESSED CHANNEL CMOS THIN FILM TRANSISTOR AND METHODS OF FABRICATION simplified abstract (Intel Corporation) (hist) [4,478 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18373936. PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.) (hist) [4,859 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 17968830. ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract (Intel Corporation) (hist) [3,733 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18228785. DISPLAY SYSTEM INCLUDING METAMATERIAL MEMBER AND MANUFACTURING METHOD OF NANOSTRUCTURE OF METAMATERIAL MEMBER simplified abstract (Samsung Display Co., LTD.) (hist) [3,316 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:35, 26 April 2024 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation) (hist) [4,597 bytes] Wikipatents (talk | contribs) (Creating a new page)