Murata Manufacturing Co., Ltd. patent applications published on October 12th, 2023

Summary of the patent applications from Murata Manufacturing Co., Ltd. on October 12th, 2023

Murata Manufacturing Co., Ltd. has recently filed several patents related to radio frequency modules, electronic component mounting structures, multilayer substrates, high frequency modules, filter circuits, filter devices, and acoustic wave devices. These patents demonstrate the company's focus on developing innovative technologies in the field of electronics and telecommunications.

Notable applications of these patents include:

• The development of a radio frequency module with a metallic body positioned between components, which can enhance the module's performance and stability.
• The creation of an electronic component mounting structure with a bonding layer containing a copper-tin alloy, improving the reliability and durability of the structure.
• The design of a multilayer substrate with varying signal line widths and distances, allowing for more efficient signal transmission and reduced interference.
• The development of a high frequency module with a resin layer and shield layer, providing protection and insulation for the circuit component.
• The implementation of filter circuits in radio frequency modules to control signal frequencies, allowing for more precise signal filtering and transmission.
• The creation of filter devices with ladder filters and acoustic wave resonators, expanding the range of frequencies that can be filtered and transmitted.
• The use of interdigital transducers and cavities in filter devices to adjust resonance frequencies and improve filtering capabilities.
• The development of acoustic wave devices with multiple layers and different plane orientations, optimizing their performance and functionality.
• The design of acoustic wave devices with support structures, insulating films, and cavities, enhancing their durability and performance.

Overall, Murata Manufacturing Co., Ltd. is actively pursuing advancements in radio frequency technology, electronic component mounting structures, multilayer substrates, high frequency modules, filter circuits, filter devices, and acoustic wave devices. These patents demonstrate the company's commitment to innovation and its dedication to improving the performance and functionality of electronic devices.

Patent applications for Murata Manufacturing Co., Ltd. on October 12th, 2023

FILTER (18334772)

Main Inventor

Masaru BANJU

Brief explanation

The abstract describes a filter that consists of a base portion with two main surfaces and multiple holes passing through it. The filter also has two deformable protrusions between two adjacent holes, creating a gap that allows communication between these holes.

Abstract

A filter that includes: a filter base portion that has a first main surface and a second main surface opposite from the first main surface and that defines a plurality of through-holes extending between the first main surface and the second main surface; and a first protrusion and a second protrusion between a first set of two adjacent through-holes of the plurality of through-holes, the first protrusion and the second protrusion being elastically deformable, and the first protrusion and the second protrusion defining a first gap through which the first set of two adjacent through-holes communicate with each other.

COIL COMPONENT (18189725)

Main Inventor

Keiichi ISHIDA

Brief explanation

The abstract describes a coil component that consists of an element assembly and an outer electrode. The element assembly includes a coil conductor, which is a conductor coated with an insulating film, and a magnetic portion made of metal magnetic particles and resin. The outer electrode is electrically connected to the exposed surface of the extended part of the coil conductor. The metal magnetic particles in the magnetic portion have a particle size distribution with at least two peaks and at least one minimum point. The larger magnetic particles are equal to or larger than the minimum point with the lowest frequency.

Abstract

A coil component includes an element assembly including a coil conductor formed by winding a conductor coated with an electrically insulating film and a magnetic portion containing metal magnetic particles and resin, and an outer electrode electrically connected to an exposed surface of an extended part of the coil conductor, exposed on a surface of the element assembly and disposed on the surface of the element assembly. The metal magnetic particles include first and second metal magnetic particles. A particle size distribution of the metal magnetic particles, calculated in accordance with a circle equivalent diameter obtained from a cross-sectional image in a cross section of the magnetic portion, has at least two peaks and at least one bottom. The large magnetic particles are larger than or equal to the bottom having a minimum frequency.

LAMINATED COIL COMPONENT (18186720)

Main Inventor

Reiji OZAWA

Brief explanation

The abstract describes a laminated coil component that consists of an insulating layer body with layers stacked on top of each other, a coil inside the body, and an external electrode on the surface of the body that is connected to the coil. The coil is made up of conductors that are also stacked in the same direction as the layers, and they are connected through a via conductor that goes through the insulating layer. The coil conductors are divided into three parts: a first part with three or more adjacent conductors, a second part with the same number of conductors as the first part, and an intermediate part between the first and second parts with one or two conductors.

Abstract

A laminated coil component includes an element body including insulating layers laminated in a lamination direction, a coil inside the element body, and an external electrode on a surface of the element body and electrically connected to the coil. The coil includes a coil conductors laminated in the lamination direction and electrically connected via a via conductor penetrating the insulating layer in the lamination direction. The coil conductors include a first laminated portion including three or more of the coil conductors adjacent to each other, a second laminated portion including the coil conductors adjacent to each other such that a number of the coil conductors in the second laminated portion is the same as a number of the coil conductors in the first laminated portion, and an intermediate portion adjacent to and between the first and second laminated portions and including one or two of the coil conductors.

LAMINATED COIL COMPONENT (18191868)

Main Inventor

Reiji OZAWA

Brief explanation

The abstract describes a laminated coil component that consists of an element body made up of insulating layers, a coil inside the body, and an external electrode on the body's surface. The coil is made up of coil conductors that are connected through a via conductor that penetrates the insulating layer. The coil conductors have a section where they overlap each other, and this section is connected in parallel by the via conductor. The coil is also connected to the external electrode through lead-out conductors that have small diameter via conductors penetrating the insulating layer.

Abstract

A laminated coil component includes an element body formed by laminating insulating layers in a lamination direction, a coil inside the body, and an external electrode on a surface of the body and electrically connected to the coil. The coil includes coil conductors laminated in the lamination direction and electrically connected via a via conductor penetrating the insulating layer in the lamination direction. The coil conductors include a laminated portion including adjacent coil conductors. The laminated portion has a parallel section in which all the coil conductors constituting the laminated portion overlap each other when viewed from the lamination direction. The parallel sections are connected in parallel by the via conductor. The coil is electrically connected to the same external electrode via lead-out conductors, each including a lead-out via conductor having a diameter of 100 µm or less and penetrating the insulating layer in the lamination direction.

METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT (18210137)

Main Inventor

Yuta TANAKA

Brief explanation

This abstract describes a method for manufacturing a ceramic electronic component. The process involves several steps, including producing ceramic chip element assemblies, preparing a jig with chip storing portions, storing the chip element assemblies in the jig, working on the chip element assemblies, and finally removing them from the jig. The method aims to simplify the manufacturing process of ceramic electronic components.

Abstract

A method for manufacturing a ceramic electronic component includes a ceramic chip element assembly production step of producing ceramic chip element assemblies, a jig preparation step of preparing a jig with chip storing portions including a bottom portion to support a ceramic chip element assembly from below and an open-top side wall portion, a ceramic chip element assembly storing step of storing the ceramic chip element assemblies in the chip storing portions in a one-to-one correspondence, a ceramic chip element assembly working step of working the ceramic chip element assemblies stored in the chip storing portions, and a ceramic chip element assembly removal step of removing the ceramic chip element assemblies from the chip storing portions.

SECONDARY BATTERY (18128099)

Main Inventor

Naoki HAYASHI

Brief explanation

This abstract describes a type of secondary battery that has a positive electrode, a negative electrode, and an electrolytic solution. The negative electrode is made up of a Si-based material and a binder. The Si-based material has a core made of a compound containing silicon, and it is covered by a material with specific properties. This covering material has a lower elastic modulus than the binder, meaning it is more flexible. It can stretch up to 100% of its original length without breaking, and it can recover 70% or more of its original shape after being stretched.

Abstract

A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The negative electrode includes a Si-based negative electrode active material and a negative electrode binder. The Si-based negative electrode active material includes an active material core and a covering material. The active material core includes a Si-containing compound. The covering material covers at least a portion of a surface of the active material core. The covering material has an elastic modulus lower than an elastic modulus of the negative electrode binder. The covering material has an elongation at break of 100% or higher, and has a recovery of 70% or higher after being stretched to an elongation at break of 100%.

PRIMARY BATTERY (18209781)

Main Inventor

Kohei WATANABE

Brief explanation

The abstract describes a primary battery that consists of three main components: a positive electrode, a negative electrode, and an electrolytic solution. The positive electrode contains manganese dioxide, while the negative electrode is made of a lithium-based material. The electrolytic solution is composed of an alkali metal compound (represented by Formula 1) and a dicarboxylic anhydride compound (represented by Formula 2).

Abstract

A primary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The positive electrode includes manganese dioxide. The negative electrode includes a lithium-based material. The electrolytic solution includes an alkali metal compound represented by Formula (1) and a dicarboxylic anhydride compound represented by Formula (2).

ELECTROLYTE SHEET FOR SOLID OXIDE FUEL CELLS, METHOD FOR PRODUCING ELECTROLYTE SHEET FOR SOLID OXIDE FUEL CELLS, AND SINGLE CELL FOR SOLID OXIDE FUEL CELLS (18334669)

Main Inventor

Seiji FUJITA

Brief explanation

The abstract describes an electrolyte sheet used in solid oxide fuel cells. The sheet is made of a ceramic plate body composed of ceramic grains containing sintered zirconia. The ceramic grains have a specific particle size distribution, where there is a difference of at least 2.5 μm between the particle size at which 90% of the particles are smaller (Data 90% cumulative probability) and the particle size at which 10% of the particles are smaller (Data 10% cumulative probability).

Abstract

An electrolyte sheet for solid oxide fuel cells that includes a ceramic plate body including ceramic grains containing sintered zirconia, wherein the ceramic grains have a number-based cumulative particle size distribution with a difference of 2.5 μm or more between a particle size Dat a 90% cumulative probability and a particle size Dat a 10% cumulative probability.

SECONDARY BATTERY, ELECTRONIC EQUIPMENT, AND ELECTRIC TOOL (18136080)

Main Inventor

Rikako IMOTO

Brief explanation

This abstract describes a new type of battery with a low internal resistance. The battery consists of an electrode wound body, positive and negative electrode current collector plates, and an outer package. The electrode wound body is made up of stacked positive and negative electrodes with a separator in between, and is wound into a coil shape. The outer package holds the electrode wound body and the current collector plates. The negative electrode has a band-shaped foil with a section covered in a negative electrode active material layer and a section uncovered. The electrode wound body has a flat surface where the uncovered parts of the negative electrode protrude and are bent towards the center of the coil. This flat surface is connected to the negative electrode current collector plate. The negative electrode foil has two major surfaces, with the first one facing towards the center of the coil and the second one facing away. The glossiness of the first surface is denoted as G and the glossiness of the second surface is also denoted as G. It is stated that G>G, meaning that the glossiness of the first surface is greater than the glossiness of the second surface.

Abstract

A battery having a low internal resistance is provided. A secondary battery includes an electrode wound body, a positive electrode current collector plate, a negative electrode current collector plate, and an outer package. The electrode wound body has a structure in which a positive electrode having a band shape and a negative electrode having a band shape are stacked with a separator interposed therebetween, and are in a wound configuration. The outer package contains the electrode wound body, the positive electrode current collector plate, and the negative electrode current collector plate. The negative electrode includes, on a negative electrode foil having a band shape, a negative electrode active material covered part covered with a negative electrode active material layer, and a negative electrode active material uncovered part. The electrode wound body has a flat surface, in which portions of the negative electrode active material uncovered part that protrude from one end of the electrode wound body are bent toward a central axis of the electrode wound body to form the flat surface. The flat surface is joined to the negative electrode current collector plate. The negative electrode foil has a first major surface facing toward the central axis, and a second major surface facing away from the central axis. Where a glossiness of the first major surface is denoted as G and a glossiness of the second major surface is denoted as G, G>G is satisfied.

TRANSMISSION LINE AND ELECTRONIC DEVICE (18201211)

Main Inventor

Nobuo IKEMOTO

Brief explanation

The abstract describes a transmission line that consists of an element body with layers of signal conductor and ground conductor. The element body also includes an insulator layer. There is a hole in the insulator layer that goes through it in the up-down direction of the element body. The hole partially overlaps with the signal conductor layer when viewed from the up-down direction. The hole has left and right hole-defining surfaces, each with upper and lower ends in the left-right direction of the element body.

Abstract

A transmission line includes an element body, a signal conductor layer, and a ground conductor layer. The element body includes an insulator layer. The signal conductor layer is below the insulator layer, and the ground conductor layer is above the insulator layer in an element body up-down direction. A hole is located at a surface of the insulator layer and penetrates the insulator layer in the element body up-down direction. At least a portion of the hole overlaps the signal conductor layer when viewed in the element body up-down direction. The hole extends between a left hole-defining surface and a right hole-defining surface. In a cross section orthogonal to the element body front-back direction, the left hole-defining surface includes a left upper end and a left lower end in the element body left-right direction, and the right hole-defining surface includes a right upper end and a right lower end in the element body left-right direction.

ANTENNA MODULE AND COMMUNICATION DEVICE EQUIPPED WITH THE SAME (18335181)

Main Inventor

Natsumi MINAMITANI

Brief explanation

This abstract describes an antenna module that consists of a dielectric substrate, radiating elements, and a dielectric layer. The radiating elements are placed on or within the dielectric substrate, and they are positioned next to each other when viewed from above. The dielectric layer is then applied to cover the radiating elements. The radiating elements are linear antennas. The dielectric layer has a higher dielectric constant than the dielectric substrate, and it is thinner than the substrate.

Abstract

An antenna module includes a dielectric substrate, radiating elements disposed in or on the dielectric substrate, and a dielectric layer. The radiating element is disposed next to the radiating element in a plan view seen from the direction normal to the dielectric substrate. The dielectric layer is disposed to cover the radiating element. The radiating element is a linear antenna. The dielectric constant of the dielectric layer is higher than the dielectric constant of the dielectric substrate. The thickness of the dielectric layer is smaller than the thickness of the dielectric substrate.

ELECTRICAL CONNECTOR AND ELECTRICAL CONNECTOR SET PROVIDED WITH THE ELECTRICAL CONNECTOR (18333398)

Main Inventor

Hideki TSUKAMOTO

Brief explanation

The abstract describes an electrical connector that is designed to reduce radiation noise at high frequencies. It consists of an inner terminal, an outer terminal, and a holding member that insulates and holds the terminals. The holding member has different surfaces, including one facing the circuit board and another opposite to it. The outer terminal has two parts, one extending along the surface facing the circuit board and another connected to it and extending along the inner side surface.

Abstract

An electrical connector which suppresses radiation noise at a high frequency from an inner terminal, and an electrical connector set provided with the electrical connector. An electrical connector includes an inner terminal; an outer terminal surrounding the inner terminal; and a holding member that has electrically insulating properties, extends in the long-side direction and the short-side direction, and is configured to hold the inner terminal and the outer terminal. The holding member has a first surface located on the first side that is the side facing a mounting circuit board, a second surface located on the second side opposite from the first side, and an inner side surface and an outer side surface connecting the first surface to the second surface. The outer terminal includes a first part extending along the first surface, and an inner part connected to the first part and extending along the inner side surface.

SWITCHING POWER SUPPLY DEVICE (18335075)

Main Inventor

Yuki ISHIKURA

Brief explanation

The abstract describes a switching power supply device that consists of two main circuits: an inverter circuit and a noise reduction circuit. The noise reduction circuit is designed to reduce electrical noise in the device. It includes two half-bridge capacitor circuits, one connected to the DC input line and the other to the AC output line. These capacitor circuits are connected by a common-mode choke coil, which helps filter out noise. Additionally, there is an electrical path that connects the middle points of the two capacitor circuits.

Abstract

A switching power supply device includes an inverter circuit and a noise reduction circuit. The noise reduction circuit includes a first half-bridge capacitor circuit coupled to the DC input line, a second half-bridge capacitor circuit coupled to the AC output line, a first common-mode choke coil coupled between the first half-bridge capacitor circuit and the second half-bridge capacitor circuit, and an electrical path that electrically couples a middle point of the first half-bridge capacitor circuit with a middle point of the second half-bridge capacitor circuit.

ADJUSTABLE THREE OUTPUT DC VOLTAGE SUPPLY WITH SHORT CIRCUIT PROTECTION (18210793)

Main Inventor

Frank WARNES

Brief explanation

The abstract describes a circuit that can provide three different DC voltages. It has positive and negative voltage buses connected to a power source. There is a voltage divider connected between the positive and negative buses, which includes a shunt regulator that provides an intermediate voltage. Another voltage divider is connected between the positive or negative bus and the intermediate voltage, and it has an output connected to a reference input of the shunt regulator. There is also a short circuit protection component connected to the low voltage side of the shunt regulator, which limits the current in case of a short circuit.

Abstract

An adjustable three output DC voltage supply circuit includes positive and negative DC voltage buses that connect to a DC power source; a first voltage divider connected between the positive and negative DC voltage buses and including a shunt regulator that is connected to the positive DC voltage bus and that provides an intermediate voltage supply; a second voltage divider connected between the positive or the negative DC voltage bus and the intermediate voltage supply and including an output that is connected to a reference input of the shunt regulator; and a short circuit protection component connected in series to a low voltage side of the shunt regulator and configured to limit the current through the shunt regulator in the case of a short circuit to the intermediate voltage supply.

POWER FACTOR CORRECTION SWITCHING POWER SUPPLY DEVICE (18334154)

Main Inventor

Hiroyuki TAKATSUJI

Brief explanation

The abstract describes a power factor correction switching power supply device. It consists of several components, including a power factor correction circuit, capacitor circuits, a choke coil, and an electric path. The device is designed to balance common mode noise and improve power factor correction.

Abstract

A power factor correction switching power supply device includes a power factor correction circuit connected to an alternating-current input line, a first half-bridge capacitor circuit connected between lines of the AC input line, a second half-bridge capacitor circuit connected between lines of a direct-current output line that is closer to a load than a first output capacitor, a common mode choke coil disposed between the first output capacitor and the second half-bridge capacitor circuit, and an electric path configured to electrically connect a midpoint of the first half-bridge capacitor circuit and a midpoint of the second half-bridge capacitor circuit to form a noise balancing circuit. The noise balancing circuit has a potential different from a potential of a ground and is configured to balance common mode noise.

SWITCHING POWER SUPPLY DEVICE (18335058)

Main Inventor

Tatsuya HOSOTANI

Brief explanation

The abstract describes a switching power supply device that has power supply input lines, DC output lines, a DC-DC converter circuit, and a noise reduction circuit. The noise reduction circuit consists of two half-bridge capacitor circuits, a common mode choke coil, and an electrical path. The first half-bridge capacitor circuit is connected between the power supply input lines, while the second half-bridge capacitor circuit is connected between the DC output lines. The electrical path connects the midpoint of the first half-bridge capacitor circuit to the midpoint of the second half-bridge capacitor circuit.

Abstract

A switching power supply device includes power supply input lines, DC output lines, a DC-DC converter circuit, and a noise reduction circuit. The noise reduction circuit includes a first half-bridge capacitor circuit that is connected between the power supply input lines, a second half-bridge capacitor circuit that is connected between the DC output lines, a first common mode choke coil, and an electrical path. The electrical path electrically connects a midpoint of the first half-bridge capacitor circuit to a midpoint of the second half-bridge capacitor circuit.

THREE OUTPUT DC VOLTAGE SUPPLY WITH SHORT CIRCUIT PROTECTION (18210820)

Main Inventor

Frank WARNES

Brief explanation

The abstract describes a power supply circuit that provides three different voltage supplies: positive, intermediate, and negative. It consists of positive and negative DC voltage buses connected to a power source. The circuit includes two voltage dividers connected between the positive and negative buses. The first voltage divider, which includes a transistor, generates the intermediate voltage supply. The second voltage divider is connected to the first transistor. Additionally, there is a short circuit protection module that includes a second transistor connected between the outputs of the voltage dividers. This module also includes a current limiting element connected to the first transistor, which helps limit power dissipation in case of a short circuit to the intermediate voltage supply.

Abstract

A power supply circuit for providing a positive, intermediate, and negative voltage supply includes positive and negative DC voltage buses that connect to a power source; a first voltage divider that is connected between the positive and the negative DC voltage buses, that includes a first transistor connected to the negative DC voltage bus, and that provides the intermediate voltage supply; a second voltage divider that is connected between the positive and the negative DC voltage buses and that is connected to the first transistor; and a short circuit protection module that includes a second transistor connected between outputs of the first and second voltage dividers and connected to the first transistor and that includes a current limiting element connected to the first transistor and configured to limit power dissipated by the first transistor in the case of a short circuit to the intermediate voltage supply.

DRIVE CONTROL DEVICE AND ULTRASONIC MOTOR SYSTEM (18336194)

Main Inventor

Mitsushiro TERASAWA

Brief explanation

The abstract describes a drive control device for an ultrasonic motor. The device includes a speed detector, a controller, and a drive circuit unit. The speed detector measures the driving speed of the motor, while the controller sets the drive conditions for the motor. The drive circuit unit applies a drive voltage to the motor's piezoelectric elements based on the drive conditions set by the controller. Additionally, the controller adjusts the drive conditions based on the accumulated operation time for each driving speed of the motor.

Abstract

A drive control device is provided that drives an ultrasonic motor element including a vibrating body and piezoelectric elements provided on the vibrating body. The drive control device includes a speed detector that detects a driving speed of the ultrasonic motor element, a controller that sets drive conditions of the ultrasonic motor element, and a drive circuit unit that applies a drive voltage to the piezoelectric elements based on the drive conditions set by the controller. Moreover, the controller sets the drive conditions of the ultrasonic motor element based on the accumulated operation time for each driving speed of the ultrasonic motor element.

AMPLIFIER CIRCUIT (18332994)

Main Inventor

Daisuke WATANABE

Brief explanation

The abstract describes an amplifier circuit that includes a variable transconductance amplifier, a power distributor, and a bypass path with a switch. The amplifier is connected to the power distributor, and the bypass path allows the signal to bypass the power distributor. The input impedance of the power distributor is different from the output impedance of the power distributor.

Abstract

An amplifier circuit includes an amplifier including a common drain or a common collector having variable transconductance, a power distributor connected to an output side of the amplifier, and a switch arranged in series on a bypass path, which branches from a path with which the amplifier is connected to the power distributor, bypasses the power distributor, and is joined to an output of the power distributor. Input impedance (Zin) of the power distributor has a value different from that of output impedance (Zout1) of the power distributor.

ACOUSTIC WAVE DEVICE (18130930)

Main Inventor

Toshimaro YONEDA

Brief explanation

This abstract describes an acoustic wave device that consists of two layers of piezoelectric material, specifically lithium niobate or lithium tantalate. Each layer has a set of electrodes on one side, with the first layer having two electrodes and the second layer having two different electrodes. The arrangement of the first layer and its electrodes forms a resonator for acoustic waves, as does the second layer with its electrodes. The crystal orientation of the first layer is at a different angle compared to the direction perpendicular to the lengthwise direction of its electrodes, while the crystal orientation of the second layer is also at a different angle compared to the direction perpendicular to the lengthwise direction of its electrodes.

Abstract

An acoustic wave device includes first and second piezoelectric layers including lithium niobate or lithium tantalate, a pair of first and second electrodes on a first principal surface of the first piezoelectric layer, and a pair of third and fourth electrodes on a first principal surface of the second piezoelectric layer, wherein the first piezoelectric layer and the first and second electrodes define a first acoustic wave resonator, the second piezoelectric layer and the third and fourth electrodes define a second acoustic wave resonator, and an angle between a crystal orientation of the first piezoelectric layer and a direction perpendicular or substantially perpendicular to a lengthwise direction of the pair of the first and second electrodes is different from an angle between a crystal orientation of the second piezoelectric layer and a direction perpendicular or substantially perpendicular to a lengthwise direction of the pair of the third and fourth electrodes.

ACOUSTIC WAVE DEVICE (18209516)

Main Inventor

Kazunori INOUE

Brief explanation

The abstract describes an acoustic wave device that includes several components. These components include a support substrate, a piezoelectric layer, an IDT electrode, a wiring electrode, and a high thermal conductive film. The piezoelectric layer is located on the support substrate and has a main surface. There is a cavity portion between the support substrate and the piezoelectric layer. The IDT electrode is located on the main surface and consists of first and second busbars, as well as first and second electrode fingers connected to these busbars. The wiring electrode is also located on the main surface and is connected to the IDT electrode. The high thermal conductive film is present in the piezoelectric layer and has a higher thermal conductivity than the piezoelectric layer itself. A portion of the IDT electrode overlaps with the cavity portion, and the high thermal conductive film also overlaps with the cavity portion. Either the IDT electrode or the wiring electrode is directly connected to the high thermal conductive film, or they are connected to it via a metal.

Abstract

An acoustic wave device includes a support substrate, a piezoelectric layer on the support substrate and including a main surface, a cavity portion between the support substrate and the piezoelectric layer, an IDT electrode on the main surface and including first and second busbars, and first and second electrode fingers respectively connected to the first and second busbars, a wiring electrode on the main surface and connected to the IDT electrode, and a high thermal conductive film in the piezoelectric layer and having a thermal conductivity higher than a thermal conductivity of the piezoelectric layer. A portion of the IDT electrode is in a region overlapping the cavity portion, the high thermal conductive film is in a region overlapping the cavity portion, and at least one of the IDT electrode and the wiring electrode is connected to the high thermal conductive film directly or via a metal.

ACOUSTIC WAVE DEVICE (18204979)

Main Inventor

Minefumi OUCHI

Brief explanation

This abstract describes an acoustic wave device that consists of several layers, including a support substrate, a piezoelectric layer, an energy confining layer, and two resonators. The piezoelectric layer is made of either lithium niobate or lithium tantalate and has a first principal surface. The energy confining layer is located between the support substrate and the piezoelectric layer. Each resonator has a pair of electrodes attached to the first principal surface of the piezoelectric layer. The first resonator generates a specific type of wave called a thickness-shear mode bulk wave, while the second resonator generates a different type of wave.

Abstract

An acoustic wave device includes a support substrate, a piezoelectric layer, an energy confining layer, a first resonator, and a second resonator. The piezoelectric layer includes a first principal surface and includes lithium niobate or lithium tantalate. The energy confining layer is provided between the support substrate and the piezoelectric layer. Each of the first resonator and the second resonator includes at least one pair of a first electrode and a second electrode provided to the first principal surface of the piezoelectric layer. The first resonator is structured to generate a thickness-shear mode bulk wave, and the second resonator is structured to generate a wave other than a thickness-shear mode bulk wave.

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH THICK DIELECTRIC LAYER FOR IMPROVED COUPLING (18194256)

Main Inventor

Ventsislav YANTCHEV

Brief explanation

The abstract describes a device called a bulk acoustic resonator. It consists of a substrate, a piezoelectric plate, and an interdigital transducer (IDT) on the front surface of the plate. The IDT is designed to generate a specific type of acoustic wave within the plate. The device also includes a half-lambda dielectric layer on either the front or back surface of the plate. The thickness of this layer is related to the wavelength of a specific type of acoustic wave resonance within the layer. Additionally, an acoustic Bragg reflector is placed between the substrate and the back surface of the plate. This reflector is designed to reflect the primary acoustic wave. The top layer of the reflector makes contact with either the piezoelectric plate or the half-lambda dielectric layer.

Abstract

A bulk acoustic resonator that includes a substrate, a piezoelectric plate, and an interdigital transducer (IDT) formed on the front surface of the piezoelectric plate. The IDT is configured to excite a primary shear acoustic mode within the piezoelectric plate. Also included is a half-lambda dielectric layer on at least one of the front surface or the back surface of the piezoelectric plate, where a thickness of the half-lambda dielectric layer is related to a wavelength of a fundamental shear bulk acoustic wave resonance in the half-lambda dielectric layer. The device further includes an acoustic Bragg reflector sandwiched between the surface of the substrate and the back surface of the piezoelectric plate, the acoustic Bragg reflector configured to reflect the primary acoustic mode. A top layer of the alternating layers of the acoustic Bragg reflector contacts the piezoelectric plate or the half-lambda dielectric layer.

ACOUSTIC WAVE DEVICE (18208918)

Main Inventor

Katsumi SUZUKI

Brief explanation

This abstract describes an acoustic wave device that consists of several layers, including a support substrate, an intermediate layer, a piezoelectric layer, and an IDT electrode. The device also includes a cavity portion within the support. The piezoelectric layer has a membrane portion that overlaps with the cavity portion. The IDT electrode is located within the membrane portion. Additionally, there is a spacer layer within the support, made of a different material than the other layers. The spacer layer is located in a portion of the device that is not the cavity portion.

Abstract

An acoustic wave device includes a support including support substrate and an intermediate layer on the support substrate, a piezoelectric layer on the intermediate layer, and an IDT electrode on the piezoelectric layer. A cavity portion is provided in the support. The piezoelectric layer includes a membrane portion overlapping the cavity portion in a plan view. At least a portion of the IDT electrode is in the membrane portion. A spacer layer is in the support and made of a material different from materials of the piezoelectric layer and the intermediate layer. The spacer layer is located in a portion other than the cavity portion.

ACOUSTIC WAVE DEVICE (18210710)

Main Inventor

Kazunori INOUE

Brief explanation

This abstract describes an acoustic wave device that consists of several components. These components include a support, a piezoelectric layer, an IDT electrode with busbars and electrode fingers, and a insulating film. The device also has a cavity on the support side of the piezoelectric layer. The cavity's outer edge has two portions that face each other in the direction of the electrode fingers. The insulating film covers the tip end portions of the second electrode fingers and extends over the first outer peripheral edge portion of the cavity.

Abstract

An acoustic wave device includes a support, a piezoelectric layer, an IDT electrode including first and second busbars and first and second electrode fingers, and a first insulating film on the piezoelectric layer and that covers tip end portions of the second electrode fingers. In a multilayer body including the support and the piezoelectric layer, a cavity is provided on a side of the support with respect to the piezoelectric layer. In plan view, an outer peripheral edge of the cavity includes first and second outer peripheral edge portions facing each other in an electrode-finger extending direction. The first outer peripheral edge portion is on a side of the first busbar, and the first insulating film extends on the side of the first busbar, and, in plan view, overlaps the first outer peripheral edge portion of the cavity.

ACOUSTIC WAVE DEVICE (18124592)

Main Inventor

Katsuya DAIMON

Brief explanation

The abstract describes an acoustic wave device that consists of several layers on a silicon substrate. These layers include a polysilicon layer, a silicon oxide layer, a piezoelectric layer, and an interdigital transducer electrode. The silicon substrate can have a plane orientation of (100), (110), or (111). The thickness of the piezoelectric layer is less than or equal to about one wavelength, where the wavelength is determined by the pitch of the electrode fingers on the interdigital transducer electrode.

Abstract

An acoustic wave device includes a silicon substrate, a polysilicon layer provided on the silicon substrate, a silicon oxide layer directly or indirectly provided on the polysilicon layer, a piezoelectric layer directly or indirectly provided on the silicon oxide layer, and an interdigital transducer electrode provided on the piezoelectric layer. A plane orientation of the silicon substrate is any one of (100), (110), and (111), and, where a wave length that is defined by an electrode finger pitch of the interdigital transducer electrode is λ, a thickness of the piezoelectric layer is less than or equal to about 1λ.

LADDER FILTER WITH TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATORS HAVING DIFFERENT PITCHES (18194012)

Main Inventor

Sean MCHUGH

Brief explanation

The abstract describes a filter device that uses a piezoelectric plate supported by a substrate. The device includes multiple resonators, each with interdigital transducers (IDTs) that have interleaved fingers. These IDTs are placed over cavities on the piezoelectric plate. The resonators have different pitches for their interleaved fingers, which helps adjust their resonance frequencies. Additionally, a dielectric layer is applied to the surface of the piezoelectric plate.

Abstract

A filter device is provided that includes a substrate having a surface and a piezoelectric plate supported by the substrate. A plurality of interdigital transducers (IDTs) for multiple resonators are provided that each have interleaved fingers at respective diaphragms of the piezoelectric plate disposed over one or more cavities. Moreover, a first resonator includes a first plurality of interleaved fingers having a first pitch and a second resonator includes a second plurality of interleaved fingers having a second pitch that is different than the first pitch. This configuration adjusts the resonance frequencies of each resonator. Moreover, a dielectric layer may be uniformly disposed over at least one surface of the respective diaphragms of the piezoelectric plate.

FILTER DEVICE, RADIO-FREQUENCY MODULE, AND COMMUNICATION DEVICE (18210136)

Main Inventor

Masanori KATO

Brief explanation

The abstract describes a filter device that consists of a filter substrate and a ladder filter. The ladder filter includes components called inductors and acoustic wave resonators, which are used to filter out specific frequencies. The inductors are connected to the acoustic wave resonators. The ladder filter has a wider range of frequencies that it can allow to pass through compared to the resonance range of the acoustic wave resonators. The series arm resonator is made from a material called piezoelectric substrate, while the parallel arm resonator is made from a different type of piezoelectric substrate.

Abstract

A filter device includes a filter substrate and a ladder filter at the filter substrate. The ladder filter includes at least one inductor and acoustic wave resonators including a series arm resonator and a parallel arm resonator. The at least one inductor is coupled to the acoustic wave resonators. A pass bandwidth of the ladder filter is larger than a resonance bandwidth of at least one of the acoustic wave resonators. The series arm resonator includes a first piezoelectric substrate. The parallel arm resonator includes a second piezoelectric substrate that is different from the first piezoelectric substrate.

RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE (18333099)

Main Inventor

Shinya HITOMI

Brief explanation

The abstract describes a radio frequency module that includes different filter circuits to manage different frequency bands. The first filter circuit is connected to an antenna terminal and a first input/output terminal and allows signals in a lower frequency band to pass through. The second filter circuit is connected to the same antenna terminal but a different input/output terminal and allows signals in a higher frequency band to pass through. The module also includes a band-elimination filter circuit on the second path that attenuates signals in a specific frequency range above the second frequency band. The second filter circuit is an LC filter circuit that uses an inductor and a capacitor.

Abstract

A radio frequency module includes: a first filter circuit disposed on a first path that connects an antenna terminal and a first input/output terminal, and having a passband that is a first frequency band; a second filter circuit disposed on a second path that connects the antenna terminal and a second input/output terminal, and having a passband that is a second frequency band higher than the first frequency band; and a band-elimination filter circuit disposed on the second path and having an attenuation band that is a partial band of a third frequency band that belongs to an unlicensed band ranging from 5 GHz or higher, and is higher than the second frequency band. The second filter circuit is an LC filter circuit that includes an inductor and a capacitor.

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS (18155995)

Main Inventor

Yukiya YAMAGUCHI

Brief explanation

The abstract describes a high frequency module that consists of a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has two main surfaces facing each other. The circuit component is mounted on one of the main surfaces. The resin layer is placed on the same main surface and covers part of the circuit component. The shield layer covers part of the resin layer and the main surface of the circuit component that is far from the mounting substrate. The high frequency module has a gap at various positions, including between the circuit component and the resin layer, between the circuit component and the shield layer, inside the resin layer, and inside the shield layer.

Abstract

The high frequency module includes a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The circuit component is mounted on the first main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers at least part of an outer peripheral surface of the circuit component. The shield layer covers at least part of the resin layer and a main surface of the circuit component that is far from the mounting substrate. The high frequency module has a gap at at least one of a position between the circuit component and the resin layer, a position between the circuit component and the shield layer, a position inside the resin layer, and a position inside the shield layer.

MULTILAYER SUBSTRATE (18208920)

Main Inventor

Tomohiro NAGAI

Brief explanation

The abstract describes a multilayer substrate that has two regions, one thicker and one thinner. It also has two signal lines that extend across both regions. In the region where the signal lines face each other, the width of the lines is smaller in the thinner region compared to the thicker region. Additionally, the distance between the signal lines is smaller in the thinner region compared to the thicker region.

Abstract

A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.

MULTILAYER SUBSTRATE (18208921)

Main Inventor

Tomohiro NAGAI

Brief explanation

This abstract describes a multilayer substrate that consists of an insulator with two regions, one thicker than the other. The substrate also includes two signal lines that run across both regions. In the region where the signal lines face each other, the width of both lines is smaller in the thinner region compared to the thicker region. Additionally, the distance between the two signal lines is also smaller in the thinner region compared to the thicker region.

Abstract

A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME (18335383)

Main Inventor

Takashi KITAHARA

Brief explanation

The abstract describes an electronic component mounting structure that includes a circuit board with a first electrode containing copper (Cu) and an electronic component with a second electrode. The second electrode consists of a first plating containing nickel (Ni) and a second plating containing tin (Sn). An intermediate bonding layer is present between the first plating and the first electrode, which includes a first region containing a copper-tin (Cu-Sn) alloy and a second region containing tin.

Abstract

The present disclosure is directed to an electronic component mounting structure including: a circuit board provided on a surface thereof with a first electrode containing Cu as a main component; and an electronic component mounted on the circuit board, the electronic component including a second electrode on a surface thereof; wherein the second electrode includes a first plating containing Ni as a main component and a second plating containing Sn as a main component formed on a surface of the first plating, and an intermediate bonding layer is provided between the first plating and the first electrode, and the intermediate bonding layer includes a first region containing an alloy of Cu and Sn as a main component and a second region containing Sn as a main component.

RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE (18333677)

Main Inventor

Takayuki OSHIMA

Brief explanation

This abstract describes a radio frequency module that consists of several components and a metallic body connected to a ground. The module includes a substrate with two major surfaces facing each other. On the first major surface, there is a first component, followed by a second component placed on top of it. Additionally, a third component is also present on or over the first major surface of the substrate. The metallic body is connected to the ground and one end is connected to the first major surface of the substrate. In a plan view, the metallic body is positioned between the first and third components.

Abstract

A radio frequency module includes a substrate having a first major surface and a second major surface that face each other, a first component disposed on or over the first major surface of the substrate, a second component disposed on the first component, a third component disposed on or over the first major surface of the substrate, and a metallic body connected to a ground. One end of the metallic body is connected to the first major surface of the substrate; and in plan view, the metallic body is disposed between the first component and the third component.