US Patent Application 18335383. ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME simplified abstract
Contents
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Takashi Kitahara of Nagaokakyo-shi (JP)
Kensuke Otake of Nagaokakyo-shi (JP)
Kyo Shin of Nagaokakyo-shi (JP)
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18335383 Titled 'ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME'
Simplified Explanation
The abstract describes an electronic component mounting structure that includes a circuit board with a first electrode containing copper (Cu) and an electronic component with a second electrode. The second electrode consists of a first plating containing nickel (Ni) and a second plating containing tin (Sn). An intermediate bonding layer is present between the first plating and the first electrode, which includes a first region containing a copper-tin (Cu-Sn) alloy and a second region containing tin.
Original Abstract Submitted
The present disclosure is directed to an electronic component mounting structure including: a circuit board provided on a surface thereof with a first electrode containing Cu as a main component; and an electronic component mounted on the circuit board, the electronic component including a second electrode on a surface thereof; wherein the second electrode includes a first plating containing Ni as a main component and a second plating containing Sn as a main component formed on a surface of the first plating, and an intermediate bonding layer is provided between the first plating and the first electrode, and the intermediate bonding layer includes a first region containing an alloy of Cu and Sn as a main component and a second region containing Sn as a main component.
