US Patent Application 18208921. MULTILAYER SUBSTRATE simplified abstract
Contents
MULTILAYER SUBSTRATE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Tomohiro Nagai of Nagaokakyo-shi (JP)
MULTILAYER SUBSTRATE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18208921 Titled 'MULTILAYER SUBSTRATE'
Simplified Explanation
This abstract describes a multilayer substrate that consists of an insulator with two regions, one thicker than the other. The substrate also includes two signal lines that run across both regions. In the region where the signal lines face each other, the width of both lines is smaller in the thinner region compared to the thicker region. Additionally, the distance between the two signal lines is also smaller in the thinner region compared to the thicker region.
Original Abstract Submitted
A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.
