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Category:Joan Rey Villarba Buot of Escondido CA (US)
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Pages in category "Joan Rey Villarba Buot of Escondido CA (US)"
The following 6 pages are in this category, out of 6 total.
1
- 17455576. RECESS STRUCTURE FOR PADLESS STACK VIA simplified abstract (QUALCOMM Incorporated)
- 17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17816502. DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17879594. PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION simplified abstract (QUALCOMM Incorporated)
