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Category:H01L23/427
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Pages in category "H01L23/427"
The following 11 pages are in this category, out of 11 total.
1
- 17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)
- 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
- 18520425. COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY simplified abstract (Intel Corporation)
I
- Intel corporation (20240105585). SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS simplified abstract
- Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on March 28th, 2024
