US Patent Application 18366788. SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME simplified abstract
SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company Limited
Inventor(s)
Chin-Hua Wang of New Taipei City (TW)
Po-Yao Lin of Zhudong Township (TW)
Shin-Puu Jeng of Po-Shan Village (TW)
SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18366788 titled 'SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME
Simplified Explanation
- The patent application describes a semiconductor package that includes a lid with one or more heat pipes for improved thermal management. - The lid is designed to be thermally integrated with the semiconductor package, allowing for more uniform heat loss. - This integration helps reduce the risk of damage to the package caused by excessive heat accumulation. - Additionally, the use of heat pipes in the lid allows for the lid to be made from less expensive materials, leading to cost reduction in the semiconductor package.
Original Abstract Submitted
A semiconductor package including a lid having one or more heat pipes located on and/or within the lid to provide improved thermal management. A lid for a semiconductor package having one or more heat pipes thermally integrated with the lid may provide more uniform heat loss from the semiconductor package, reduce the risk of damage to the package due to excessive heat accumulation, and may enable the lid to be fabricated using less expensive materials, thereby reducing the costs of a semiconductor package.
