Category:H01L23/38

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Pages in category "H01L23/38"

The following 9 pages are in this category, out of 9 total.

1

18152131. PACKAGE STRUCTURE HAVING THERMOELECTRIC COOLER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

2

20240011678. SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR simplified abstract (BYD COMPANY LIMITED)

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Blockchain patent applications on January 11th, 2024

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US Patent Application 18448100. METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE simplified abstract

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