20240011678. SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR simplified abstract (BYD COMPANY LIMITED)
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SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR
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SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240011678 titled 'SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR
Simplified Explanation
The abstract describes a semiconductor refrigeration chip and a method for manufacturing it. The method involves providing a semiconductor refrigeration assembly consisting of two insulating and heat-conducting layers and a semiconductor layer arranged between them. One side of the assembly is the cold end, while the other side is the hot end. A packaging structure is formed to cover the side wall of the assembly and create a groove with one of the insulating layers, resulting in the semiconductor refrigeration chip.
- The semiconductor refrigeration chip is manufactured by sandwiching a semiconductor layer between two insulating and heat-conducting layers.
- The chip has a cold end and a hot end, with the insulating layers defining these ends.
- A packaging structure is formed to cover the side wall of the chip and create a groove with one of the insulating layers.
- The resulting semiconductor refrigeration chip can be used for cooling applications.
Potential applications of this technology:
- Cooling electronic devices, such as computer processors or power amplifiers.
- Cooling sensors or detectors in scientific instruments.
- Cooling components in medical devices, such as laser systems or imaging equipment.
Problems solved by this technology:
- Efficient cooling of electronic devices or sensitive components.
- Miniaturization of cooling systems.
- Improved thermal management in various applications.
Benefits of this technology:
- Enhanced performance and reliability of electronic devices.
- Compact and lightweight cooling solutions.
- Energy efficiency and reduced power consumption.
- Improved temperature control and stability.
Original Abstract Submitted
a semiconductor refrigeration chip and a method for manufacturing same are provided. the method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.
